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Details, datasheet, quote on part number:1N5908RL
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Datasheet text preview:
®
1N5908 SM5908
TRANSILTM
FEATURES UNIDIRECTIONAL TRANSIL DIODE PEAK PULSE POWER : 1500 W (10/1000µs) REVERSE STAND OFF VOLTAGE : 5 V LOW CLAMPING FACTOR FAST RESPONSE TIME UL RECOGNIZED DESCRIPTION The 1N5908 and SM5908 are dedicated to the 5 V logic circuit protection (TTL and CMOS technologies). Their low clamping voltage at high current level guarantees excellent protection for sensitive components. ABSOLUTE MAXIMUM RATINGS (Tamb = 25°C). Symbol PPP P IFSM Tstg Tj TL Parameter Peak pulse power dissipation (see note1) Power dissipation on infinite heatsink Non repetitive surge peak forward current for unidirectional types Storage temperature range Maximum junction temperature Maximum lead temperature for soldering during 10s (at 5mm from case for CB429) CB429 SMC Tj initial = Tamb Tamb = 75°C tp = 10ms Tj initial = Tamb Value 1500 5 200 - 65 to + 175 175 230 260 Unit W W A °C °C °C °C
CB429
SMC
Note 1 : For a surge greater than the maximum values, the diode will fail in short-circuit.
THERMAL RESISTANCES Symbol Rth (j-l) Rth (j-a) Junction to leads Junction to ambient on printed circuit. L lead = 10 mm On recommended pad layout CB429 SMC Parameter Value 20 75 75 Unit °C/W °C/W °C/W
August 1999 Ed : 2A
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1N5908/SM5908
ELECTRICAL CHARACTERISTICS(Tamb = 25°C)
I
Symbol VRM VBR VCL IRM IPP
Parameter Stand-off voltage Breakdown voltage Clamping voltage Leakage current @ VRM Peak pulse current Voltage temperature coefficient
VCL VBR VRM
IF
VF IRM V
T
VF
IPP
Forward voltage
IRM @ VRM Types max
VBR @ IR min note2
VCL @ IPP max 10/1000µs V 7.6 A 30
VCL @ IPP max 10/1000µs V 8 A 60
VCL @ IPP max 10/1000µs V 8.5 A 120
T max note3 10 /°C 5.7
-4
C typ note4 pF 9500
µA 1N5908 SM5908 300
V 5
V 6
mA 1
% IPP 100
10 µs
Fig. 1: Peak pulse power dissipation versus initial junction temperature (printed circuit board).
50
0
1000 µs
t
Note 2 : Note 3 : Note 4 :
Pulse test : tp < 50ms VBR = T*(Tamb-25)* VBR (25°C). VR = 0V, F = 1 MHz
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1N5908/SM5908
Fig. 2 : Peak pulse power versus exponential pulse duration.
Fig. 3 :
Clamping voltage versus peak pulse current. Exponential waveform tp = 10 ms...... tp = 1 ms------------tp = 20 µs________
Note : The curves of the figure 3 are specified for a junction temperature of 25 °C before surge. The given results may be extrapolated for other junction temperatures by using the following formula : VBR = T *(Tamb - 25) * VBR (25°C).
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1N5908/SM5908
Fig. 4 : Capacitance versus reverse applied vol t a ge (typical values). Fig. 5 : Peak forward voltage drop versus peak forward current.
Fig. 6a/6b : Transient thermal impedance junction-ambient versus pulse duration. Fig. 6a : CB429 Package. (For FR4 PC Board with L lead = 10 mm) Fig. 6b : SMC Package. Mounting on FR4 PC Board with recommended pad layout.
Fig. 7 : Relative variation of leakage current versus junction temperature.
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1N5908/SM5908
ORDER CODE 1N5908 RL Device code Packaging : = Ammopack tape RL = Tape and reel SM 5908 Numerical code Surface mount
MARKING : Logo, type code and cathode band Package SMC CB429 Type SM5908 1N5908 Marking MDC 1N5908
A white band indicates the cathode
PACKAGE MECHANICAL DATA SMC (Plastic) DIMENSIONS REF.
E1
Millimeters Min. Max. 2.45 0.20 3.2 0.41 8.15 7.15 4.70 6.25 1.60 1.90 0.05 2.90 0.15 7.75 6.60 4.40 5.55 0.75
Inches Min. 0.075 0.002 0.114 0.006 0.305 0.260 0.173 0.218 0.030 Max. 0.096 0.008 0.126 0.016 0.321 0.281 0.185 0.246 0.063
A1
D
A2 b c
E
E E1
A1
E2
C L A2
D
b
E2
L FOOT PRINT (in millimeters)
3.3
2.0
4.2
2.0
Packaging : Standard packaging is in tape and reel.
Weight = 0.25 g.
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