Details, datasheet, quote on part number: M28W160BB
PartM28W160BB
CategoryMemory => Flash => NOR Flash => Industry Standard Boot Block 3V
TitleIndustry Standard Boot Block 3V
Description16 Mbit (1MB X16, Boot BLOCK) 3V Supply Flash Memory
CompanyST Microelectronics, Inc.
DatasheetDownload M28W160BB datasheet
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Features, Applications
16 Mbit (1Mb x16, Boot Block) 3V Supply Flash Memory

FEATURES SUMMARY s SUPPLY VOLTAGE VDD to 3.6V Core Power Supply VDDQ= to 3.6V for Input/Output VPP = 12V for fast Program (optional)

ACCESS TIME: 85, 90,100ns PROGRAMMING TIME 10s typical Double Word Programming Option
MEMORY BLOCKS Parameter Blocks (Top or Bottom location) Main Blocks

BLOCK PROTECTION on TWO PARAMETER BLOCKS WP for Block Protection AUTOMATIC STAND-BY MODE PROGRAM and ERASE SUSPEND 100,000 PROGRAM/ERASE CYCLES per BLOCK ELECTRONIC SIGNATURE Manufacturer Code: 20h Top Device Code, 90h Bottom Device Code, M28W160BB: 91h

TABLE OF CONTENTS SUMMARY DESCRIPTION. 5 Figure 2. Logic Diagram. 5 Table 1. Signal Names. 5 Figure 3. TSOP Connections. 6 Figure 4. BGA Connections (Top view through package). 7 Figure 5. TFBGA Connections (Top view through package). 8 Figure 6. Block Addresses. 9 SIGNAL DESCRIPTIONS. 10 Address Inputs (A0-A19). Data Input/Output (DQ0-DQ15). Chip Enable (E). Output Enable (G). Write Enable (W). Write Protect (WP). Reset (RP). VDD Supply Voltage. VDDQ Supply Voltage. VPP Program Supply Voltage. VSS Ground...................................................................................................................................................................................................................................................................................................................................................................................................................................

BUS OPERATIONS. 11 Read. Write. Output Disable. Standby. Automatic Standby. Reset. Table 2. Bus Operations...........................................................................................................................................................................................................................................................................

COMMAND INTERFACE. 12 Read Memory Array command. 12 Read Status Register Command. 12 Read Electronic Signature Command. 12 Read CFI Query Command. 12 Block Erase Command. 12 Program Command. 12 Double Word Program Command. 13 Clear Status Register Command. 13 Program/Erase Suspend Command. 13 Program/Erase Resume Command. 13 Block Protection. 13 Table 3. Commands. 14 Table 4. Read Electronic Signature. 14

Table 5. Memory Blocks Protection Truth Table. 14 Table 6. Program, Erase Times and Program/Erase Endurance Cycles. 15 STATUS REGISTER. 16 Program/Erase Controller Status (Bit 7). Erase Suspend Status (Bit 6). Erase Status (Bit 5). Program Status (Bit 4). VPP Status (Bit 3). Program Suspend Status (Bit 2). Block Protection Status (Bit 1). Reserved (Bit 0). Table 7. Status Register Bits.................................................................................................................................................................................................................................................................................................

MAXIMUM RATING. 18 Table 8. Absolute Maximum Ratings. 18 DC and AC PARAMETERS. 19 Table 9. Operating and AC Measurement Conditions. 19 Figure 7. AC Measurement I/O Waveform. 19 Figure 8. AC Measurement Load Circuit. 19 Table 10. Device Capacitance. 19 Table 11. DC Characteristics. 20 Figure 9. Read Mode AC Waveforms. 21 Table 12. Read AC Characteristics. 21 Figure 10. Write AC Waveforms, Write Enable Controlled. 22 Table 13. Write AC Characteristics, Write Enable Controlled. 23 Figure 11. Write AC Waveforms, Chip Enable Controlled. 24 Table 14. Write AC Characteristics, Chip Enable Controlled. 25 Figure 12. Power-Up and Reset AC Waveforms. 26 Table 15. Power-Up and Reset AC Characteristics. 26 PACKAGE MECHANICAL. 27 Figure - 48 lead Plastic Thin Small Outline, x 20mm, Package Outline. 27 Table - 48 lead Plastic Thin Small Outline, x 20mm, Package Mechanical Data. 27 Figure BGA46 6.39x6.37mm ball array, 0.75 mm pitch, Bottom View Package Outline28 Table BGA46 6.39x6.37mm ball array, 0.75 mm pitch, Package Mechanical Data. 28 Figure 15. BGA46 Daisy Chain - Package Connections (Top view through package). 29 Figure 16. BGA46 Daisy Chain - PCB Connections proposal (Top view through package). 29 Figure - 8x6 ball array, 0.75mm pitch, Bottom View Package Outline30 Table - 8x6 ball array, 0.75mm pitch, Package Mechanical Data. 30 Figure 18. TFBGA46 Daisy Chain - Package Connections (Top view through package). 31 Figure 19. TFBGA46 Daisy Chain - PCB Connections proposal (Top view through package). 31 PART NUMBERING. 32


 

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