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Part: M29W400B-90ZA6TR
Category:
Memory
-> Flash
Description: 4 Mbit 512kb x8 or 256kb X16, Boot Block Low Voltage Single Supply Flash Memory
Company: ST Microelectronics, Inc.
Datasheet: Download M29W400B-90ZA6TR datasheet File size : 840 kB
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Datasheet text preview:
M29W400T M29W400B
4 Mbit (512Kb x8 or 256Kb x16, Boot Block) Low Voltage Single Supply Flash Memory
N OT FOR NEW DESIGN
M29W400T and M29W400B are replaced respectively by the M29W400BT and M29W400BB 2.7V to 3.6V SUPPLY VOLTAGE for PROGRAM, ERASE and READ OPERATIONS FAST ACCESS TIME: 90ns FAST PROGRAMMING TIME 10µs by Byte / 16µs by Word typical PROGRAM/ERASE CONTROLLER (P/E.C.) Program Byte-by-Byte or Word-by-Word Status Register bits and Ready/Busy Output MEMORY BLOCKS Boot Block (Top or Bottom location) Parameter and Main blocks BLOCK, MULTI-BLOCK and CHIP ERASE MULTI BLOCK PROTECTION/TEMPORARY UNPROTECTION MODES ERASE SUSPEND and RESUME MODES Read and Program another Block during Erase Suspend LOW POWER CONSUMPTION Stand-by and Automatic Stand-by 100,000 PROGRAM/ERASE CYCLES per BLOCK 20 YEARS DATA RETENTION Defectivity below 1ppm/year ELECTRONIC SIGNATURE Manufacturer Code: 0020h Device Code, M29W400T: 00EEh Device Code, M29W400B: 00EFh DESCRIPTION T he M29W400 is a non-volatile memory that may be erased electrically at the block or chip level and programmed in-system on a Byte-by-Byte or Wordby-Word basis using only a single 2.7V to 3.6V VCC supply. For Program and Erase operations the necessary high voltages are generated internally. T he device can also be programmed in standard programmers. T he array matrix organisation allows each block to be erased and reprogrammed without affecting other blocks. Blocks can be protected against programing and erase on programming equipment ,
N ovember 1999
44
1
TSOP48 (N ) 12 x 20 m m
SO44 (M)
BGA
FBGA48 (ZA) 8 x 6 solder balls
Figure 1. Logic Diagram
VCC
18 A0-A17 W E G RP M29W400T M29W400B
15 DQ0-DQ14 DQ15A1 BYTE RB
VSS
AI02065
1/34
This is information o n a product still in product ion but not recommende d for new designs.
M29W400T, M29W400B
F igure 2A. TSOP Pin Connections
A15 A14 A13 A12 A11 A10 A9 A8 NC NC W RP NC NC RB NC A17 A7 A6 A5 A4 A3 A2 A1 1 48 A16 BYTE VSS DQ15A1 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VCC DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 G VSS E A0
Figure 2B. TSOP Reverse Pin Connections
A16 BYTE VSS DQ15A1 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VCC DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 G VSS E A0 1 48 A15 A14 A13 A12 A11 A10 A9 A8 NC NC W RP NC NC RB NC A17 A7 A6 A5 A4 A3 A2 A1
12 13
M29W400T M29W400B (Normal)
37 36
12 13
M29W400T M29W400B (Reverse)
37 36
24
25
AI02066
24
25
AI02067
Warning: NC = Not Connected.
Warning: NC = Not Connected.
F igure 2C. SO Pin Connections
Table 1. Signal Names
A0-A17 Address Inputs Data Input/Outputs, Command Inputs Data Input/Outputs Data Input/Output or Address Input Chip Enable Output Enable Write Enable Reset / Block Temporary Unprotect Ready/Busy Output Byte/Word Organisation Supply Voltage Ground
NC RB A17 A7 A6 A5 A4 A3 A2 A1 A0 E VSS G DQ0 DQ8 DQ1 DQ9 DQ2 DQ10 DQ3 DQ11
1 2 3 4 5 6 7 8 9 10 11 M29W400T 12 M29W400B 13 14 15 16 17 18 19 20 21 22
44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23
RP W A8 A9 A10 A11 A12 A13 A14 A15 A16 BYTE VSS DQ15A1 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VCC
DQ 0-DQ7 DQ 8-DQ14 DQ 15A1 E G W RP RB B YTE VC C VSS
AI02068
Warning: NC = Not Connected. 2/34
M29W400T, M29W400B
F igure 2D. FBGA Package Ball Out (Top View)
1 2 3 4 5 6 7 8
F
A13
A12
A14
A15
A16
BYTE
DQ15 A1
VSS
E
A9
A8
A10
A11
DQ7
DQ14
DQ13
DQ6
D
W
RP
NC
NC
DQ5
DQ12
VCC
DQ4
C
RB
NC
NC
NC
DQ2
DQ10
DQ11
DQ3
B
A7
A17
A6
A5
DQ0
DQ8
DQ9
DQ1
A
A3
A4
A2
A1
A0
E
G
VSS
AI00912
Warning: NC = Not Connected.
Table 2. Absolute Maximum Ratings ( 1)
Symbol TA TBIAS TSTG VIO (2) VC C V (A9, E , G , RP)
(2)
Parameter Ambient Operating Temperature Temperature Under Bias Storage Temperature Input or O utput Voltages Supply Voltage A9, E, G, RP Voltage
(3)
Value 40 to 85 50 to 125 65 to 150 0.6 to 5 0.6 to 5 0.6 to 13.5
Unit °C °C °C V V V
N otes: 1. Except for the r ating "Operating Temperature Range", stresses above those listed in t he Table "Absolute Maximum Ratings" may cause permanent damage to the device. These are s tress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not i mplied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. R efer als o to the S TMicroelectronics SURE Program and other relevant quality documents. 2. Minimum Voltage may undershoot t o 2V during transition and for less than 20ns. 3. Depends on range.
DESCRIPTION (Cont'd) and temporarily unprotect ed to make change s in t he application. Each block can be programmed and erased over 100,00 0 cycles. I nstructions for Read/Reset, Auto Select f or reading the Electronic Signature or Block Protection status, Programming, Block and Chip Erase, Erase
Suspen d and Resume are written to the device in cycles of commands to a Command Interface using standard microprocessor write timings. The device is offered in TSOP48 (12 x 20mm), SO44 and FBGA48 (8 x 6 balls, 0.8mm pitch) packages. Both normal and reverse pinouts are available for the TSOP48 package.
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