Details, datasheet, quote on part number: STLC2410B
CategoryCommunication => Wireless => Bluetooth
DescriptionBluetooth Baseband
CompanyST Microelectronics, Inc.
DatasheetDownload STLC2410B datasheet
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Features, Applications

FEATURES Bluetooth® V1.1 specification compliant Point-to-point, point-to-multi-point (up to 7 slaves) and scatternet capability Asynchronous Connection-Less (ACL) link support giving data rates to 721kbps Synchronous Connection-Oriented (SCO) link Standard BlueRF bus interface ARM7TDMI CPU ­ 32-bit Core ­ Run from 13MHz external clock ­ Support of 32 kHz crystal for low power mode Memory organization ­ 64KByte on-chip RAM ­ 4KByte on-chip boot ROM ­ Programmable external memory interface (EMI) or 16-bit external data bus to 3 programmable chip-select signals ­ Hold-acknowledge bus arbitration support HW support for all packet types ­ ACL: 3, 5 and 5 ­ SCO: 2, 3 and DV1 Communication interfaces ­ Serial Synchronous Interface ­ Two enhanced 16550 UART's with 128 byte fifo depth ­ 12Mbps USB interface ­ Fast master I2C bus interface ­ Multi slot PCM interface ­ 16 programmable GPIO ­ 2 external interrupts and various interrupt possibilities through other interfaces Ciphering support for to 128-bit key Receiver Signal Strenght Indication (RSSI) support for power-controlled links Separate control for external power amplifier (PA) for power class1 support. Software support ­ Low level (up to HCI) stack or embedded stack with profiles ­ Support of UART and USB HCI transport layers Idle and power down modes ­ Ultra low power in idle mode ­ Low standby current

1.1 Applications Features Typical applications in which the STLC2410B can be used are:

Portable computers, PDA Modems Handheld data transfer devices Cameras Computer peripherals Other type of devices that require the wireless communication provided by Bluetooth® Cable replacement

2 DESCRIPTION The STLC2410B offers a compact and complete solution for short-range wireless connectivity. It incorporates all the lower layer functions of the Bluetooth® protocol. The microcontroller allows the support of all data packets of Bluetooth® in addition to voice. The embedded controller can be used to run the Bluetooth® protocol and application layers if required. The software is located in an external memory accessed through the external memory interface.

This is preliminary information, details are subject to change without notice.

3.1 Absolute Maximum Ratings Operation of the device beyond these conditions is not guaranteed. Sustained exposure to these limits will adversely affect device reliability Table 1. Absolute Maximum Ratings

Symbol VDD VDDIO VIN Tamb Tstg Tlead Supply voltage core Supply voltage I/O input voltage on any digital pin Operating ambient temperature Storage temperature Lead temperature < 10s VSS Conditions Min VSS - 0.5 Max 2.5 4 VDDIO Unit V °C

3.2 Operating Ranges Operating ranges define the limits for functional operation and parametric characteristics of the device. Functionality outside these limits is not implied. Table 2. Operating Ranges

Symbol VDD VDDIO Conditions Supply voltage digital core and emi pads Supply voltage digital IO Min 1.55 2.7 Typ 1.8 3.3 Max 1.95 3.6 Unit V

3.3 I/O specifications Depending on the interface, the I/O voltage is typical 1.8V (interface to the flash memory) or typical 3.3V (all the other interfaces). These I/Os comply to the EIA/JEDEC standard JESD8-B. 3.3.1 Specifications for 3.3V I/Os Table 3. LVTTL DC Input Specification (3V<VDDIO<3.6V)

Symbol Vil Vih Vhyst Parameter Low level input voltage High level input voltage Schmitt trigger hysteresis 2 0.4 Conditions Min Typ Max 0.8 Unit V

Symbol Vol Voh Parameter Low level output voltage Conditions Iol mA VDDIO-0.15 Min Typ Max 0.15 Unit V Note 1

Note X is the source/sink current under worst case conditions according to the drive capability. (See table 8, pad information for value of X).

Symbol Vil Vih Vhyst Parameter Low level input voltage High level input voltage Schmitt trigger hysteresis 0.3 0.5 Conditions Min Typ Max 0.35*VDD Unit V

Symbol Vol Voh Parameter Low level output voltage High level output voltage Conditions Iol X mA Ioh =-X mA VDD-0.15 Min Typ Max 0.15 Unit V Note 1

Note X is the source/sink current under worst case conditions according to the drive capability. (See table 8, pad information for value of X).

3.4 Current Consumption Table 7. Typical power consumption of the STLC2410B and External Flash using UART (VDD = VDD Flash = PLLVDD = 1.8V, VDDIO = 3.3V)

Core STLC2410B State Slave Standby (no low power mode) Standby (low power mode enabled) ACL connection (no transmission) ACL connection (data transmission) SCO connection (no codec connected) Inquiry and Page scan (low power mode enabled) Low Power mode (32 kHz crystal) Master n.a. µA IO Unit


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