ˇ Designed to be mounted on one side of the PCBˇ with light emitting through a hole.ˇ Eliminates the need for second reflow solderingˇ Excellent for status indicator and edge lighting
ˇ Mobile Devices (cellular phones, pagers, PDAs)ˇ Computersˇ Telecommunication
IF Peak p TYP. Spectral Line Dominant Half Width d TYP. IF
(Ta=25°C) Yellow Green PY Green PG Pure Green V °C mA/°C
Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Derating* Pd IF IFM VR Topr Tstg IF BR
Please follow these handling precautions to prevent damage to the chip and ensure its reliability. 1. Soldering conditions:ˇ Soldering iron: Temperature at tip of iron: 280°C max. (30W max.) Soldering time: 3 sec. max.ˇ Dip soldering: Preheating: ~ 150°C max. (resin surface temp.) ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max.ˇ Reflow Soldering:
°C Operation Heating 240 Temperature rise: 5°C/sec. Cooling: --5°C/sec. LED Surface Temperature
2. Cleaning:ˇ If cleaning is required, use the following solutions for less than 1 minute, at less than 40°C.ˇ Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.ˇ Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Product specifications subject to change without notice. PG1111R-0301
2660 Barranca Parkway, Irvine, CA 92606ˇ Tel: 800-LED-LCD1 (533-5231)ˇ Fax: 949-222-0555 Website: www.stanley-electric.com
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