Members of the Texas Instruments Widebus TM Family 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers Flow-Through Architecture Optimizes PCB Layout Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise EPIC TM (Enhanced-Performance Implanted CMOS) 1-µm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic 300-mil Shrink Small-Outline (DL) Package Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Pin Spacings
The 'AC16240 are 16-bit buffers and line drivers designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. They can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide inverting outputs and symmetrical active-low output-enable (OE) inputs.
The 74AC16240 is packaged in TI's shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed circuit board area. The 54AC16240 is characterized for operation over the full military temperature range to 125°C. The 74AC16240 is characterized for operation from to 85°C.
FUNCTION TABLE (each 4-bit buffer) INPUTS OE OUTPUT
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UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC. 7 V Input voltage range, VI (see Note V to VCC 0.5 V Output voltage range, VO (see Note V to VCC 0.5 V Input clamp current, IIK (VI VI > VCC). ±20 mA Output clamp current, IOK (VO VO > VCC). ±50 mA Continuous output current, IO (VO 0 to VCC). ±50 mA Continuous current through VCC or GND. ±400 mA Maximum power dissipation = 55°C (in still air)(see Note 2): DL package. 1.2 W Storage temperature range, Tstg. to 150°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils.