Details, datasheet, quote on part number: 74AC16245DL
CategorySemiconductors => Logic => Buffer/Driver/Transceiver => Standard Transceiver
Part family74AC16245 16-Bit Bus Transceivers With 3-State Outputs
TitleStandard Transceivers
Description16-Bit Bus Transceivers With 3-State Outputs 48-SSOP -40 to 85
CompanyTexas Instruments, Inc.
DatasheetDownload 74AC16245DL datasheet
Cross ref.Similar parts: 74AC16245DL-T, SN74ABT162244, SN74ALVC16244A, SN74ALVC16334, SN74ALVCH162244, SN74ALVCH162373, SN74ALVCH16244, SN74ALVCH16373, SN74ALVCH16374
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ICC @ Nom Voltage(Max)(mA)0.08
Operating Temperature Range(C)-40 to 85
Output Drive (IOL/IOH)(Max)(mA)-24/24
Approx. Price (US$)0.93 | 1ku
Schmitt TriggerNo
Output TypeCMOS
Package GroupSSOP
Input TypeCMOS
F @ Nom Voltage(Max)(Mhz)100
Technology FamilyAC
tpd @ Nom Voltage(Max)(ns)13.5,8.9
  Mecanical Data
Pin nbPackage typeInd stdJEDEC codePackage qtyCarrierDevice markWidth (mm)Length (mm)Thick (mm)Pitch (mm)
48DLSSOPR-PDSO-G25TUBEAC16245 7.4915.882.59.635
Application notes
• Input and Output Characteristics of Digital Integrated Circuits
This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding | Doc
• TI IBIS File Creation, Validation, and Distribution Processes
The Input/Output Buffer Information Specification (IBIS), also known as ANSI/EIA-656, has become widely accepted among electronic design automation (EDA) vendors, semiconductor vendors, and system designers as the format for digital electrical interface da | Doc
• Live Insertion
Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance | Doc
• Shelf-Life Evaluation of Lead-Free Component Finishes
The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts sh | Doc
• Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | Doc
• Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV, as generated by an IEC ESD simulator to determine the level of ISD protection provi | Doc
• Designing With Logic (Rev. C)
Data sheets, which usually give information on device behavior only under recommended operating conditions, may only partially answer engineering questions that arise during the development of systems using logic devices. However, information is frequently | Doc
• Introduction to Logic | Doc
• Implications of Slow or Floating CMOS Inputs (Rev. D) | Doc
• CMOS Power Consumption and CPD Calculation (Rev. B)
Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result, CMOS devices are best known for low power consumpti | Doc
• Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
Though low power consumption is a feature of CMOS devices, sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This docu | Doc


Features, Applications

Members of the Texas Instruments Widebust Family 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers Flow-Through Architecture Optimizes PCB Layout Distributed VCC and GND Configuration Minimizes High-Speed Switching Noise EPIC t (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Thin Shrink Small-Outline (DGG) Package, 300-mil Shrink Small-Outline (DL) Package Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Pin Spacings


The 'AC16245 are 16-bit bus transceivers organized as dual-octal noninverting 3-state transceivers designed for asynchronous two-way communication between data buses. The control function implementation minimizes external timing requirements These devices allow data transmission from the A bus to the B bus or from the B bus to the A bus, depending upon the logic level at the direction control (DIR) input. The output-enable input (OE) can be used to disable the devices so that the buses are effectively isolated.

The 74AC16245 is packaged in TI's shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area. The 54AC16245 is characterized for operation over the full military temperature range to 125°C. The 74AC16245 is characterized for operation from to 85°C.


Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC and Widebus are trademarks of Texas Instruments Incorporated.

UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303

This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

Supply voltage range, VCC. 7 V Input voltage range, VI (see Note V to VCC 0.5 V Output voltage range, VO (see Note V to VCC 0.5 V Input clamp current, IIK (VI VI > VCC). ±20 mA Output clamp current, IOK (VO VO > VCC). ±50 mA Continuous output current, IO (VO 0 to VCC). ±50 mA Continuous current through VCC or GND. ±400 mA Maximum power dissipation = 55°C (in still air) (see Note 2): DGG package. W DL package. 1.2 W Storage temperature range, Tstg. to 150°C

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The maximum package power dissipation is calculated using a junction temperature of 150_C and a board trace length of 750 mils.

54AC16245 MIN VCC VIH Supply voltage (see Note 4) High-level input voltage VCC 3 V VCC 4.5 V VCC 5.5 V VCC 3 V VIL VI VO IOH Low-level input voltage Input voltage Output voltage High-level output current VCC 3 V VCC 4.5 V VCC 5.5 V VCC 3 V IOL t/v Low-level output current Input transition rise or fall rate VCC 4.5 V VCC V 0 VCC 4.5 V VCC 5.5 V VCC NOM 5 MAX 5.5 74AC16245 MIN VCC ns/V °C mA NOM 5 MAX 5.5 UNIT V

TA Operating free-air temperature ­55 125 NOTES: 3. All unused pins (input and I/O) must be held high or low to prevent them from floating. 4. All VCC and GND pins must be connected to the proper voltage power supply.

PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice.


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