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Details, datasheet, quote on part number: 74AC16374DLR
Part74AC16374DLR
CategorySemiconductors => Logic => Flip-Flop/Latch/Register => D-Type Flip-Flop
Part family74AC16374 16-Bit Edge-Triggered D-Type Flip-Flops With 3-State Outputs
TitleD-Type (3-State) Flip-Flops
Description16-Bit Edge-Triggered D-Type Flip-Flops With 3-State Outputs 48-SSOP -40 to 85
CompanyTexas Instruments, Inc.
StatusACTIVE
ROHSCompliant
SampleNo
DatasheetDownload 74AC16374DLR datasheet
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Specifications 
3-State OutputYes
Voltage(Nom)(V)3.3,5
Output Drive (IOL/IOH)(Max)(mA)24/-24
ICC @ Nom Voltage(Max)(mA)0.08
Operating Temperature Range(C)-40 to 85
RatingCatalog
Schmitt TriggerNo
Output TypeCMOS
Package GroupSSOP
Input TypeCMOS
VCC(Min)(V)3
Approx. Price (US$)0.91 | 1ku
Bits(#)16
F @ Nom Voltage(Max)(Mhz)100
VCC(Max)(V)5.5
Technology FamilyAC
tpd @ Nom Voltage(Max)(ns)17,10.8
  Mecanical Data
Pin nbPackage typeInd stdJEDEC codePackage qtyCarrierDevice markWidth (mm)Length (mm)Thick (mm)Pitch (mm)
48DLSSOPR-PDSO-G1000LARGE T&RAC16374 7.4915.882.59.635
Application notes
• Input and Output Characteristics of Digital Integrated Circuits
This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding | Doc
• Power-Up Behavior of Clocked Devices (Rev. A) | Doc
• TI IBIS File Creation, Validation, and Distribution Processes
The Input/Output Buffer Information Specification (IBIS), also known as ANSI/EIA-656, has become widely accepted among electronic design automation (EDA) vendors, semiconductor vendors, and system designers as the format for digital electrical interface da | Doc
• Live Insertion
Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance | Doc
• Shelf-Life Evaluation of Lead-Free Component Finishes
The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts sh | Doc
• Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | Doc
• Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV, as generated by an IEC ESD simulator to determine the level of ISD protection provi | Doc
• Designing With Logic (Rev. C)
Data sheets, which usually give information on device behavior only under recommended operating conditions, may only partially answer engineering questions that arise during the development of systems using logic devices. However, information is frequently | Doc
• Introduction to Logic | Doc
• Implications of Slow or Floating CMOS Inputs (Rev. D) | Doc
• CMOS Power Consumption and CPD Calculation (Rev. B)
Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result, CMOS devices are best known for low power consumpti | Doc
• Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
Though low power consumption is a feature of CMOS devices, sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This docu | Doc

 

Features, Applications

Members of the Texas Instruments Widebus TM Family 3-State True Outputs Full Parallel Access for Loading Flow-Through Architecture Optimizes PCB Layout Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise EPIC TM (Enhanced-Performance Implanted CMOS) 1-m Process 500-mA Typical Latch-Up Immunity at 125C Package Options Include Plastic 300-mil Shrink Small-Outline (DL) Packages Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin Spacings

description

The 'AC16374 are 16-bit edge-triggered D-type flip-flops with 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

The 'AC16374 can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK) input, the Q outputs of the flip-flop take on the logic levels set up at the data (D) inputs. A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. OE does not affect the internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. The 74AC16374 is packaged in TI's shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area. The 54AC16374 is characterized for operation over the full military temperature range to 125C. The 74AC16374 is characterized for operation from to 85C.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC and Widebus are trademarks of Texas Instruments Incorporated.

UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303

This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

Supply voltage range, VCC. 7 V Input voltage range, VI (see Note V to VCC 0.5 V Output voltage range, VO (see Note V to VCC 0.5 V Input clamp current, IIK (VI VI > VCC). 20 mA Output clamp current, IOK (VO VO > VCC). 50 mA Continuous output current, IO (VO 0 to VCC). 50 mA Continuous current through VCC or GND. 400 mA Maximum power package dissipation = 55C (in still air)(see Note 2): DL package. 1.2 W Storage temperature range, Tstg. to 150C

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The maximum package power dissipation is calculated using a junction temperature of 150C and a board trace length of 750 mils.


 

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