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Part: 78HT200Series
Category:
Power Management
-> Regulators
-> Switching Regulators
-> Step-Up/Step-Down
Description: 2 Amp Positive Step-down Integrated Switching Regulator
Company: Texas Instruments, Inc.
Datasheet: Download 78HT200Series datasheet File size : 196 kB
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Datasheet text preview:
For assistance or to order, call
(800) 531-5782
78HT200
Series
2 AMP POSITIVE STEP-DOWN INTEGRATED SWITCHING REGULATOR
Revised 9/22/99
· · · · · ·
High Efficiency > 82% Wide Input Range Self-Contained Inductor Short-Circuit Protection Over-Temperature Protection Fast Transient Response
The 78HT200 is a series of wide input voltage, 3 terminal Integrated Switching Regulators (ISRs). Employing a ceramic substrate, these ISRs have a maximum output current of 2A. The output voltage is laser trimmed for high accuracy. The 78HT200 series regulators have internal short-circuit and overtemperature protection and may be used in a wide variety of applications.
Pin-Out Information
Pin No. Function
1 2 3
Vin
1 3
Ordering Information
78HT2 XX
Output Voltage 33 = 3.3 Volts 46 = 4.6 Volts 05 = 5.0 Volts 53 = 5.25 Volts 65 = 6.5 Volts 75 = 7.5 Volts 10 = 10.0 Volts
YC
Package Suffix V = Vertical Mount S = Surface Mount H = Horizontal Mount
Standard Application
78HT200
2
Vin GND Vout
Vout + GND
C1 GND
C2
C1 = Optional 1µF ceramic C2 = Required 100µF electrolytic
(For dimensions and PC board layout see Package Style 500.)
Specifications
Characteristics (Ta = 25°C unless noted) Output Current Input Voltage Range Output Voltage Tolerance Line Regulation Load Regulation Ripple/Noise Transient Response (with 100µF output cap) Efficiency Switching Frequency Absolute Maximum Operating Temperature Range Recommended Operating Temperature Range Thermal Resistance Storage Temperature Mechanical Shock Mechanical Vibration Weight
** See Thermal Derating chart.
78HT200 SERIES
Symbols Io Vi n V o Regline Regload Vn ttr
Conditions Over Vin range Io = 0.1 to 2.0A Vo 4.6V Over Vin range, Io = 2.0A
Ta = 0°C to +60°C
Min 0.1* 7 Vo +2V -- -- -- -- -- -- 700 0.95 -40
Typ -- -- -- ±1.0 ±0.4 ±0.2 1 100 5.0 82 750 1.0 --
Max 2.0 15 28 ±2.0 ±0.8 ±0.4 -- -- -- 800 1.05 +85
Units A V V %Vo %Vo %Vo %Vo µSec %Vo % kHz MHz °C
Over Vin range 0.1 Io 2.0A
Vin = Vin min, Io = 2.0A
50% load change Vo over/undershoot Vin = 9V, Io = 2.0A, Vo = 5V Over Vin and Io ranges Vo > 4.6V Vo = 3.3V -- Free Air Convection, (40-60LFM) Over Vin and Io ranges Free Air Convection, (40-60LFM) -- Per Mil-STD-883D, Method 2002.3 Per Mil-STD-883D, Method 2007.2, 20-2000 Hz, soldered in a PC board --
o Ta Ta
-40 -- -40 -- -- --
-- 38 -- 500 5 7
+85** -- +125 -- -- --
°C °C/W °C G's G's Grams
j a
Ts -- -- --
* ISR will operate down to no load with reduced specifications.
Note: The 78HT200 Series requires a 100µF electrolytic or tantalum output capacitor for proper operation in all applications.
Power Trends, Inc. 27715 Diehl Road, Warrenville, IL 60555 (800) 531-5782 Fax: (630) 393-6902 http://www.powertrends.com
For assistance or to order, call
(800) 531-5782
78HT200
CHARACTERISTIC DATA
Series
78HT233_ 3.3 VDC
(See Note 1)
78HT205_ 5.0 VDC
(See Note 1)
Efficiency vs Output Current
100 90 100 90
Efficiency vs Output Current
Efficiency (%)
8. 0V 10. 0V 12. 0V 14. 0V 15. 0V
Efficiency (%)
80 70 60 50 40 0.0 0.5 1.0 1.5 2.0
Vin
80 70 60 50 40 0.0 0.5 1.0 1.5 2.0
Vin
8.0V 10. 0V 15. 0V 20. 0V 28. 0V
Iout (A)
Iout (A)
Ripple vs Output Current
30 25 20 15 10 5 0 0.0 0.5 1.0 1.5 2.0 60 50
Ripple vs Output Current
Vin
Ripple (mV)
8.0V 10. 0V 12. 0V 14. 0V 15. 0V
Ripple (mV)
40 30 20 10 0 0.0 0.5 1.0 1.5 2.0
Vin
8.0V 10.0V 15.0V 20.0V 28.0V
Iout (A)
Iout (A)
Thermal Derating (Ta)
2.0
(See Note 2)
70°C 85°C
Thermal Derating (Ta)
2.0
(See Note 2)
60°C 70°C
1.5
1.5
85°C
Iout (A)
1.0
Iout (A)
8 10 12 14 16
1.0
0.5
0.5
0.0
0.0 8 12 16 20 24 28
Vin (Volts)
Vin (Volts)
Power Dissipation vs Output Current
2.5 2.5
Power Dissipation vs Output Current
2.0
2.0
Vin
PD (Watts)
1.5
8.0V 10.0V 12.0V 14.0V 15.0V
Vin
PD (Watts)
1.5
8. 0V 10. 0V 15. 0V 20. 0V 28. 0V
1.0
1.0
0.5
0.5
0.0 0.0 0.5 1.0 1.5 2.0
0.0 0.0 0.5 1.0 1.5 2.0
Iout (A)
Iout (A)
Note 1: All data listed in the above graphs, except for derating data, has been developed from actual products tested at 25°C. This data is considered typical data for the ISR. Note 2: Thermal derating graphs are developed in free air convection cooling of 40-60 LFM. (See Thermal Application Note)
Power Trends, Inc. 27715 Diehl Road, Warrenville, IL 60555 (800) 531-5782 Fax: (630) 393-6902 http://www.powertrends.com
IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE ("CRITICAL APPLICATIONS"). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER'S RISK. In order to minimize risks associated with the customer's applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI's publication of information regarding any third party's products or services does not constitute TI's approval, warranty or endorsement thereof.
Copyright © 1999, Texas Instruments Incorporated
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78-1 78-2 78-3
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