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Details, datasheet, quote on part number:SN65LVCP22PWR
 
 
Part:SN65LVCP22PWR
Category:Interface and Interconnect => LVDS (Low Voltage Differential Signaling)
Description:ti SN65LVCP22, 2x2 Crosspoint Switch : LVDS Outputs
Company:Texas Instruments, Inc.
Datasheet:Download SN65LVCP22PWR datasheet   File size : 236 kB
Request For quote:  Find where to buy SN65LVCP22PWR
 



Datasheet text preview:
SN65LVCP22
www.ti.com
SLLS553B ­ NOVEMBER 2002 ­ REVISED JUNE 2003
2x2 LVDS CROSSPOINT SWITCH
FEATURES D High Speed (>1000 Mbps) Upgrade for
DS90CP22 2x2 LVDS Crosspoint Switch
DESCRIPTION
The SN65LVCP22 is a 2x2 crosspoint switch providing greater than 1000 Mbps operation for each path. The dual channels incorporate wide common-mode (0 V to 4 V) receivers, allowing for the receipt of LVDS, LVPECL, and CML signals. The dual outputs are LVDS drivers to provide low-power, low-EMI, high-speed operation. The SN65LVCP22 provides a single device supporting 2:2 buffering (repeating), 1:2 splitting, 2:1 multiplexing, 2x2 switching, and LVPECL/CML to LVDS level translation on each channel. The flexible operation of the SN65LVCP22 provides a single device to support the redundant serial bus transmission needs (working and protection switching cards) of fault­tolerant switch systems found in optical networking, wireless infrastructure, and data communications systems. TI offers additional gigibit repeater/ translator and crosspoint products in the SN65LVDS100 and SN65LVDS122. The SN65LVCP22 uses a fully differential data path to ensure low-noise generation, fast switching times, low pulse width distortion, and low jitter. Output channel-tochannel skew is less than 10 ps (typ) and 50 ps (max) to ensure accurate alignment of outputs in all applications. Both SOIC and TSSOP package options are available to allow easy upgrade for existing solutions, and board area savings where space is critical.
OUTPUTS OPERATING SIMULTANEOUSLY
1 Gbps 223 ­1 PRBS OUTPUT 1
D LVPECL Crosspoint Switch Available in
SN65LVCP23
D Low-Jitter Fully Differential Data Path D 50 ps (Typ), of Peak-to-Peak Jitter
With PRBS = 223­1 Pattern Power Dissipation
D Less Than 200 mW (Typ), 300 mW (Max) Total D Output (Channel-to-Channel) Skew Is 10 ps
(Typ), 50 ps (Max)
D Configurable as 2:1 Mux, 1:2 Demux,
Repeater or 1:2 Signal Splitter
D Inputs Accept LVDS, LVPECL, and CML
Signals
D D D D
Fast Switch Time of 1.7 ns (Typ) Fast Propagation Delay of 0.65 ns (Typ) 16 Lead SOIC and TSSOP Packages Inter-Operates With TIA/EIA­644­A LVDS Standard
D Operating Temperature: ­40°C to 85°C APPLICATIONS D D D D D D
Base Stations Add/Drop Muxes Protection Switching for Serial Backplanes Network Switches/Routers Optical Networking Line Cards/Switches Clock Distribution
VCC = 3.3 V |VID| = 200 mV, VIC = 1.2 V Vertical Scale = 200 mV/div OUTPUT 2 500 MHz
Horizontal Scale = 300 ps
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright 2002­2003, Texas Instruments Incorporated
SN65LVCP22
www.ti.com SLLS553B ­ NOVEMBER 2002 ­ REVISED JUNE 2003
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
PACKAGE DESIGNATOR SOIC TSSOP PART NUMBER(1) SN65LVCP22D SN65LVCP22PW SYMBOLIZATION LVCP22 LVCP22
(1) Add the suffix R for taped and reeled carrier
PACKAGE DISSIPATION RATINGS
PACKAGE CIRCUIT BOARD MODEL High-K(2) TA 25°C POWER RATING DERATING FACTOR(1) ABOVE TA = 25°C 13.9 mW/°C TA = 85°C POWER RATING
SOIC (D) 1361 mW 544 mW TSSOP (PW) High-K(2) 1074 mW 10.7 mW/°C 430 mW (1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow. (2) In accordance with the High-K thermal metric definitions of EIA/JESD51-7.
THERMAL CHARACTERISTICS
PARAMETER JB JC PD D Junction-to-board thermal resistance thermal resistance Junction-to-case thermal resistance thermal resistance Device power dissipation power dissipation PW D PW Typical Maximum VCC = 3.3­V, TA =25°C, 1 Gbps VCC = 3.6­V, TA = 85°C, 1 Gbps TEST CONDITIONS VALUE 11.2 18.4 23.7 16.0 198 313 UNITS °C/W °C/W °C/W °C/W mW mW
FUNCTION TABLE
SEL0 0 0 1 1 SEL1 0 1 0 1 OUT0 IN0 IN0 IN1 IN1 OUT1 IN0 IN1 IN0 IN1 FUNCTION 1:2 Splitter Repeater Switch 1:2 Splitter
FUNCTIONAL BLOCK DIAGRAM
OUT 0 OUT 1
EN 0 EN 1 SEL 1 SEL 0 0 1 0 1
IN 0
IN 1
2
SN65LVCP22
www.ti.com SLLS553B ­ NOVEMBER 2002 ­ REVISED JUNE 2003
EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS
INPUTS VCC IN + IN ­
400 SEL, EN 7V 7V 300 k 7V
OUTPUTS VCC
OUT +
OUT ­
7V
7V
3