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Details, datasheet, quote on part number:SN65LVCP23PW
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| Part: | SN65LVCP23PW |
| Category: | Interface and Interconnect => LVDS (Low Voltage Differential Signaling) |
| Description: | ti SN65LVCP23, 2x2 Crosspoint Switch : Lvpecl Outputs |
| Company: | Texas Instruments, Inc. |
| Datasheet: | Download SN65LVCP23PW datasheet File size : 226 kB |
| Request For quote: | Find where to buy SN65LVCP23PW
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Datasheet text preview:
SN65LVCP23
www.ti.com
SLLS554B NOVEMBER 2002 REVISED JUNE 2003
2x2 LVPECL CROSSPOINT SWITCH
FEATURES D High Speed 2x2 LVPECL Crosspoint Switch D LVDS Crosspoint Switch Available in
SN65LVCP22
DESCRIPTION
The SN65LVCP23 is a 2x2 LVPECL crosspoint switch. The dual channels incorporate wide common-mode (0 V to 4 V) receivers, allowing for the receipt of LVDS, LVPECL, and CML signals. The dual outputs are LVPECL drivers to provide high-speed operation. The SN65LVCP23 provides a single device supporting 2:2 buffering (repeating), 1:2 splitting, 2:1 multiplexing, 2x2 switching, and LVDS/CML to LVPECL level translation on each channel. The flexible operation of the SN65LVCP23 provides a single device to support the redundant serial bus transmission needs (working and protection switching cards) of fault-tolerant switch systems found in optical networking, wireless infrastructure, and data communications systems. TI offers an additional gigibit repeater/ translator in the SN65LVDS101. The SN65LVCP23 uses a fully differential data path to ensure low-noise generation, fast switching times, low pulse width distortion, and low jitter. Output channel-to-channel skew is less than 10 ps (typ) and 50 ps (max) to ensure accurate alignment of outputs in all applications. Both SOIC and TSSOP package options are available.
OUTPUTS OPERATING SIMULTANEOUSLY
1.3 Gbps 223 1 PRBS
D 50 ps (Typ), of Peak-to-Peak Jitter
With PRBS = 2231 Pattern (Typ), 50 ps (Max)
D Output (Channel-to-Channel) Skew Is 10 ps D Configurable as 2:1 Mux, 1:2 Demux,
Repeater or 1:2 Signal Splitter
D Inputs Accept LVDS, LVPECL, and CML
Signals
D D D D
Fast Switch Time of 1.7 ns (Typ) Fast Propagation Delay of 0.75 ns (Typ) 16 lead SOIC and TSSOP Packages Operating Temperature: 40°C to 85°C
APPLICATIONS D Gigabit Ethernet Redundant Transmission
Paths
D Gigabit Interface Converters (GBICs) D Fibre Channel Redundant Transmission
Paths
OUTPUT 1
D D D D D D
HDTV Video Routing Base Stations Protection Switching for Serial Backplanes Network Switches/Routers Optical Networking Line Cards/Switches Clock Distribution
VCC = 3.3 V |VID| = 200 mV, VIC = 1.2 V Vertical Scale=400mV/div OUTPUT 2 650 MHz
Horizontal Scale = 200 ps
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright 20022003, Texas Instruments Incorporated
SN65LVCP23
www.ti.com SLLS554B NOVEMBER 2002 REVISED JUNE 2003
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
PACKAGE DESIGNATOR SOIC TSSOP PART NUMBER(1) SN65LVCP23D SN65LVCP23PW SYMBOLIZATION LVCP23 LVCP23
(1) Add the suffix R for taped and reeled carrier
PACKAGE DISSIPATION RATINGS
PACKAGE SOIC (D) CIRCUIT BOARD MODEL High-K(2) High-K(2) TA 25°C POWER RATING 1361 mW DERATING FACTOR(1) ABOVE TA = 25°C 13.9 mW/°C TA = 85°C POWER RATING 544 mW
TSSOP (PW) 1074 mW 10.7 mW/°C 430 mW (1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow. (2) In accordance with the High-K thermal metric definitions of EIA/JESD51-7.
THERMAL CHARACTERISTICS
PARAMETER JB JC PD D Junction-to-board thermal resistance thermal resistance Junction-to-case thermal resistance thermal resistance Device power dissipation power dissipation PW D PW Typical Maximum VCC = 3.3V, TA =25°C, 2 Gbps VCC = 3.6V, TA = 85°C, 2 Gbps TEST CONDITIONS VALUE 15.7 22.1 26.1 17.3 165 234 UNITS °C/W °C/W °C/W °C/W mW mW
FUNCTION TABLE
SEL0 0 0 1 1 SEL1 0 1 0 1 OUT0 IN0 IN0 IN1 IN1 OUT1 IN0 IN1 IN0 IN1 FUNCTION 1:2 Splitter Repeater Switch 1:2 Splitter
FUNCTIONAL BLOCK DIAGRAM
OUT 0 OUT 1
EN 0 EN 1 SEL 1 SEL 0 0 1 0 1
IN 0
IN 1
2
SN65LVCP23
www.ti.com SLLS554B NOVEMBER 2002 REVISED JUNE 2003
EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS
INPUTS IN + IN VCC
400 SEL, EN 7V 7V 300 k 7V
OUTPUTS VCC R VCC VCC
R
R
OUT + VCC 7V
OUT
7V
3
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