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Details, datasheet, quote on part number:SN74ALVC16501
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Datasheet text preview:
SN74ALVC16501 18-BIT UNIVERSAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS
SCAS261A JANUARY 1993 REVISED JULY 1995
D D D D D D D
EPIC TM (Enhanced-Performance Implanted CMOS) Submicron Process Member of the Texas Instruments Widebus TM Family UBT TM (Universal Bus Transceiver) Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or Clocked Mode ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Latch-Up Performance Exceeds 250 mA Per JEDEC Standard JESD-17 Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages
DGG OR DL PACKAGE (TOP VIEW)
description
The SN74ALVC16501 18-bit universal bus transceiver is designed for low-voltage (3.3-V) VCC operation; it is tested at 2.5-V, 2.7-V, and 3.3-V VCC. Data flow in each direction is controlled by output-enable (OEAB and OEBA), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the device operates in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB is held at a high or low logic level. If LEAB is low, the A-bus data is stored in the latch/flip-flop on the low-to-high transition of CLKAB. When OEAB is high, the outputs are active. When OEAB is low, the outputs are in the high-impedance state.
OEAB LEAB A1 GND A2 A3 VCC A4 A5 A6 GND A7 A8 A9 A10 A11 A12 GND A13 A14 A15 VCC A16 A17 GND A18 OEBA LEBA
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29
GND CLKAB B1 GND B2 B3 VCC B4 B5 B6 GND B7 B8 B9 B10 B11 B12 GND B13 B14 B15 VCC B16 B17 GND B18 CLKBA GND
Data flow for B to A is similar to that of A to B but uses OEBA, LEBA, and CLKBA. The output enables are complementary (OEAB is active high and OEBA is active low). The SN74ALVC16501 is available in TI's shrink small-outline (DL) and thin shrink small-outline (DGG) packages, which provide twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area. The SN74ALVC16501 is characterized for operation from 40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC, UBT, and Widebus are trademarks of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright © 1995, Texas Instruments Incorporated
POST OFFICE BOX 655303
· DALLAS, TEXAS 75265
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SN74ALVC16501 18-BIT UNIVERSAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS
SCAS261A JANUARY 1993 REVISED JULY 1995
FUNCTION TABLE INPUTS OEAB L H H H H H H LEAB X H H L L L L CLKAB X X X H L A X L H L H X X OUTPUT B Z L H L H B0
B0§ A-to-B data flow is shown: B-to-A flow is similar but uses OEBA, LEBA, and CLKBA. Output level before the indicated steady-state input conditions were established, provided that CLKAB is high before LEAB goes low § Output level before the indicated steady-state input conditions were established
logic symbol
OEAB CLKAB LEAB 1 55 2 27 OEBA CLKBA LEBA 30 28 EN1 2C3 C3 G2 EN4 5C6 C6 G5 3D 4 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 5 6 8 9 10 12 13 14 15 16 17 19 20 21 23 24 26 1 1 1 6D 52 51 49 48 47 45 44 43 42 41 40 38 37 36 34 33 31 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 54 B1
A1
3
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
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POST OFFICE BOX 655303
· DALLAS, TEXAS 75265
SN74ALVC16501 18-BIT UNIVERSAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS
SCAS261A JANUARY 1993 REVISED JULY 1995
logic diagram (positive logic)
OEAB 1
CLKAB
55
LEAB
2
LEBA
28
CLKBA
30
OEBA
27
A1
3
1D C1 CLK 1D C1 CLK
54
B1
To 17 Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 4.6 V Input voltage range, VI (except I/O ports) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 4.6 V Input voltage range, VI (I/O ports) (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to VCC + 0.5 V Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to VCC + 0.5 V Input clamp current, IIK (VI VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 50 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 100 mA Maximum power dissipation at TA = 55°C (in still air) (see Note 3): DGG package . . . . . . . . . . . . . . . . . . 1 W DL package . . . . . . . . . . . . . . . . . . 1.4 W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This value is limited to 4.6 V maximum. 3. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils. For more information, refer to the Package Thermal Considerations application note in the 1994 ABT Advanced BiCMOS Technology Data Book, literature number SCBD002B.
POST OFFICE BOX 655303
· DALLAS, TEXAS 75265
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