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Part: THS3096D
Category:
Analog & Mixed-Signal Processing
-> Amplifiers
-> High Speed/Video Amplifiers
-> Current Feedback
Description: ti THS3096, Dual- High-Voltage, Low Distortion, Current-feedback Operational Amplifier With Power-down
Company: Texas Instruments, Inc.
Datasheet: Download THS3096D datasheet File size : 726 kB
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Datasheet text preview:
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THS3091, THS3092 THS3095, THS3096
SLOS423 SEPTEMBER 2003
HIGH-VOLTAGE, LOW-DISTORTION, CURRENT-FEEDBACK OPERATIONAL AMPLIFIERS
FEATURES
· Low Distortion 77 dBc HD2 at 10 MHz, RL = 1 k 69 dBc HD3 at 10 MHz, RL = 1 k Low Noise 14 pA/Hz Noninverting Current Noise 17 pA/Hz Inverting Current Noise 2 nV/Hz Voltage Noise High Slew Rate: 7300 V/µs (G = 5, VO = 20 VPP) Wide Bandwidth: 210 MHz (G = 2, RL = 100 ) High Output Current Drive: ±250 mA Wide Supply Range: ±5 V to ±15 V Power-Down Feature: (THS3095 and THS3096 Only)
DESCRIPTION
The THS3091, THS3092, THS3095, and THS3096 are high-voltage, low-distortion, high speed, current-feedback amplifiers designed to operate over a wide supply range of ±5 V to ±15 V for applications requiring large, linear output signals such as Pin, Power FET, and VDSL line drivers. The THS3095 and THS3096 feature a power-down pin (PD) that puts the amplifier in low power standby mode, and lowers the quiescent current from 9.5 mA to 500 µA. The wide supply range combined with total harmonic distortion as low as -69 dBc at 10 MHz, in addition, to the high slew rate of 7300V/µs makes the THS309x ideally suited for high-voltage arbitrary waveform driver applications. Moreover, having the ability to handle large voltage swings driving into high resistance and capacitance loads while maintaining good settling time performance makes the THS309x ideal for Pin driver and PowerFET driver applications. The THS3091, THS3092 and THS3095 are offered in a 8-pin SOIC (D), and the 8-pin SOIC (DDA) packages with PowerPADTM. The THS3096 is offered in the 8-pin SOIC (D) and the 14-pin TSSOP (PWP) packages with PowerPAD.
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· · · · ·
APPLICATIONS
· · · · High-Voltage Arbitrary Waveform Power FET Driver Pin Driver VDSL Line Driver
HARMONIC DISTORTION vs FREQUENCY
-40 -50 Harmonic Distortion - dBc G = 5, VO = 2 VPP, RF = 1 k, RL = 100 , VS = ±15 V HD2 -70 -80 HD3
TYPICAL ARBITARY WAVEFORM GENERATOR OUTPUT DRIVE CIRCUIT 249 1 k 15 V DAC Out - + -15 V RTERM 50 50 50- Cable VOUT
-60
-90 -100 100 k
1M
10 M
100 M
f - Frequency - Hz
PowerPAD is a trademark of Texas Instruments. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
This document contains information on products in more than one phase of development. The status of each device is indicated ont he page(s) specifiying its electrical characteristics. Note: Multiple devices in mixed product status.
Copyright © 2003, Texas Instruments Incorporated
THS3091, THS3092 THS3095, THS3096
SLOS423 SEPTEMBER 2003
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling procedures and installation procedures can cause damage.
TOP VIEW THS3091 NC VIN- VIN+ VS-
1 2 3 4 8 7 6 5
D, DDA
TOP VIEW THS3092
D, DDA
NC VS+ VOUT NC
1VOUT 1VIN - 1VIN + VS-
1 2 3 4
8 7 6 5
VS+ 2VOUT 2VIN- 2VIN+
NC = No Internal Connection
NC = No Internal Connection
TOP VIEW
D, DDA THS3095
TOP VIEW THS3096 1VOUT 1VIN- 1VIN+ VS- NC REF NC
1 2 3 4 5 6 7 14 13 12 11 10 9 8
D, PWP VS+ 2VOUT 2VIN- 2VIN+ NC PD NC
REF VIN - VIN + VS-
1 2 3 4
8 7 6 5
PD VS+ VOUT NC
NC = No Internal Connection See Note A.
NC = No Internal Connection See Note A.
Note A: The devices with the power down option defaults to the ON state if no signal is applied to the PD pin. Additionallly, the REF pin functional range is from VS- to (VS+ - 4 V).
AVAILABLE OPTIONS
PACKAGED DEVICE TA PLASTIC SMALL OUTLINE SOIC (D) (1) THS3091D (3) THS3091DR (3) THS3095D (3) THS3095DR (3) THS3092D (3) Dual -40°C to 85°C THS3092DR (3) THS3096D (3) THS3096DR (3) (1) (2) (3) Available in tape and reel. The R suffix standard quantity is 2500 (e.g. THS3091DR). The PowerPAD is electrically isolated from all other pins. Product preview stage of development. PLASTIC SMALL OUTLINE SOIC (DDA) (1) (2) THS3091DDA THS3091DDAR THS3095DDA THS3095DDAR THS3092DDA (3) THS3092DDAR (3) --TSSOP (PWP) (2) ------THS3096PWP (3) THS3096PWPR (3)
Single -40°C to 85°C
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THS3091, THS3092 THS3095, THS3096
SLOS423 SEPTEMBER 2003
DISSIPATION RATING TABLE
PACKAGE D-8 (1) DDA-8 (2) PWP-14 (1) (2) JC (°C/W) 38.3 9.2 2.07 JA (°C/W) TA = 25°C 95 45.8 37.5 1.05 W 2.18 W 2.67 W POWER RATING TJ = 125°C TA = 85°C 421 mW 873 mW 1.07 W
This data was taken using the JEDEC standard low-K test PCB. For the JEDEC proposed high-K test PCB, the JA is 95°C/W with power rating at TA = 25°C of 1.32 W. Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance and long term reliability.
RECOMMENDED OPERATING CONDITIONS
MIN Supply voltage Operating free-air temperature, TA Operating junction temperature, continuous operating temperature, TJ Normal storage temperature, Tstg Dual supply Single supply ±5 10 -40 -40 -40 MAX ±15 30 85 125 85 °C UNIT V
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature (unless otherwise noted) (1)
UNIT Supply voltage, VS- to VS+ Input voltage, VI Differential input voltage, VID Output current, IO (2) Continuous power dissipation Maximum junction temperature, TJ (3) Maximum junction temperature, continuous operation, long term reliability, TJ (4) Operating free-air temperature, TA Storage temperature, Tstg Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds ESD ratings: HBM CDM MM (1) 2000 1500 150 33 V ± VS ±4V 350 mA See Dissipation Ratings Table 150°C 125°C -40°C to 85°C -65°C to 150°C 300°C
(2)
(3) (4)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under,, recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The THS3091, THS3092, THS3095, and THS3096 may incorporate a PowerPADTM on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPADTM thermally enhanced package. The absolute maximum temperature under any condition is limited by the constraints of the silicon process. The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may result in reduced reliability and/or lifetime of the device.
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Others parts begin by th
TH-1 TH-2 TH-3 TH-4 TH-5 TH-6 TH-7 TH-8 TH-9 TH-10
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