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Part: TLE2141AMJGB
Category:
Analog & Mixed-Signal Processing
-> Amplifiers
-> Operational Amplifiers
Description: ti TLE2141A, Excalibur Low-noise High-speed Precision Operational Amplifier
Company: Texas Instruments, Inc.
Datasheet: Download TLE2141AMJGB datasheet File size : 783 kB
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Datasheet text preview:
TLE214x, TLE214xA, TLE214xY EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS
SLOS183A FEBRUARY 1997 REVISED MARCH 1998
D D D D D D
Low Noise 10 Hz . . . 15 nV/Hz 1 kHz . . . 10.5 nV/Hz 10 000-pF Load Capability 20-mA Min Short-Circuit Output Current 27-V/µs Min Slew Rate High Gain-Bandwidth Product . . . 5.9 MHz Low VIO . . . 500 µV Max at 25°C
D D D D
Single or Split Supply . . . 4 V to 44 V Fast Settling Time 340 ns to 0.1% 400 ns to 0.01% Saturation Recovery . . . 150 ns Large Output Swing VCC + 0.1 V to VCC + 1 V
description
The TLE214x and TLE214xA devices are high-performance, internally compensated operational amplifiers built using Texas Instruments complementary bipolar Excalibur process. The TLE214xA is a tighter offset voltage grade of the TLE214x. Both are pin-compatible upgrades to standard industry products. The design incorporates an input stage that simultaneously achieves low audio-band noise of 10.5 nV/Hz with a 10-Hz 1/f corner and symmetrical 40-V/µs slew rate typically with loads up to 800 pF. The resulting low distortion and high power bandwidth are important in high-fidelity audio applications. A fast settling time of 340 ns to 0.1% of a 10-V step with a 2-k/100-pF load is useful in fast actuator/positioning drivers. Under similar test conditions, settling time to 0.01% is 400 ns. The devices are stable with capacitive loads up to 10 nF, although the 6-MHz bandwidth decreases to 1.8 MHz at this high loading level. As such, the TLE214x and TLE214xA are useful for low-droop sample-and-holds and direct buffering of long cables, including 4-mA to 20-mA current loops. The special design also exhibits an improved insensitivity to inherent integrated circuit component mismatches as is evidenced by a 500-µV maximum offset voltage and 1.7-µV/°C typical drift. Minimum common-mode rejection ratio and supply-voltage rejection ratio are 85 dB and 90 dB, respectively. Device performance is relatively independent of supply voltage over the ± 2-V to ± 22-V range. Inputs can operate between VCC 0.3 to VCC + 1.8 V without inducing phase reversal, although excessive input current may flow out of each input exceeding the lower common-mode input range. The all-npn output stage provides a nearly rail-to-rail output swing of VCC 0.1 to VCC + 1 V under light current-loading conditions. The device can sustain shorts to either supply since output current is internally limited, but care must be taken to ensure that maximum package power dissipation is not exceeded. Both versions can also be used as comparators. Differential inputs of VCC ± can be maintained without damage to the device. Open-loop propagation delay with TTL supply levels is typically 200 ns. This gives a good indication as to output stage saturation recovery when the device is driven beyond the limits of recommended output swing. Both the TLE214x and TLE214xA are available in a wide variety of packages, including both the industry-standard 8-pin small-outline version and chip form for high-density system applications. The C-suffix devices are characterized for operation from 0°C to 70°C, I-suffix devices from 40°C to 105°C, and M-suffix devices over the full military temperature range of 55°C to 125°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright © 1998, Texas Instruments Incorporated
POST OFFICE BOX 655303
· DALLAS, TEXAS 75265
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TLE214x, TLE214xA, TLE214xY EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS
SLOS183A FEBRUARY 1997 REVISED MARCH 1998
TLE2141 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25°C 500 µV 900 µV 500 µV 900 µV 500 µV 900 µV SMALL OUTLINE (D) TLE2141ACD TLE2141CD TLE2141AID TLE2141ID TLE2141AMD TLE2141MD CHIP CARRIER (FK) -- -- TLE2141AMFK TLE2141MFK CERAMIC DIP (JG) -- -- TLE2141AMJG TLE2141MJG PLASTIC DIP (P) TLE2141ACP TLE2141CP TLE2141AIP TLE2141IP TLE2141AMP TLE2141MP CHIP FORM (Y) -- TLE2141Y --
0°C to 70°C 40°C to 105°C 55°C to 125°C
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLE2141ACDR). Chip forms are tested at TA = 25°C only. TLE2142 AVAILABLE OPTIONS PACKAGED DEVICES TA 0°C to 70°C to 70°C 40°C to 105°C to 105°C 55°C to 125°C to 125°C VIOmax AT 25°C 750 µV 1200 µV 750 µV 1200 µV 750 µV 1200 µV SMALL OUTLINE (D) TLE2142ACD TLE2142CD TLE2142AID TLE2142ID TLE2142AMD TLE2142MD CHIP CARRIER (FK) -- -- -- -- TLE2142AMFK TLE2142MFK CERAMIC DIP (JG) -- -- -- -- TLE2142AMJG TLE2142MJG PLASTIC DIP (P) TLE2142ACP TLE2142CP TLC2142AIP TLC2142IP TLC2142AMP TLC2142MP TSSOP (PW) -- TLE2142CPWLE -- -- -- -- CHIP FORM§ (Y) -- TLE2142Y --
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2142ACDR). The PW packages are available left-ended taped and reeled. Add LE the suffix to device type (e.g., TLC2142CPWLE). § Chip forms are tested at TA = 25°C only. TLE2144 AVAILABLE OPTIONS TA 0°C to 70°C 40°C to 105°C 55°C to 125°C VIOmax AT 25°C 1.5 mV 2.4 mV 1.5 mV 2.4 mV 1.5 mV 2.5 mV PACKAGED DEVICES SMALL OUTLINE (DW) -- TLE2144CDW -- TLE2144IDW -- TLE2144MDW CHIP CARRIER (FK) -- -- -- -- TLE2144AMFK TLE2144MFK CERAMIC DIP (J) -- -- -- -- TLE2144AMJ TLE2144MJ PLASTIC DIP (N) TLE2144ACN TLE2144CN TLE2144AIN TLE2144IN TLE2144AMN TLE2144MN CHIP FORM FORM (Y) -- TLE2144Y --
The DW packages are available taped and reeled. Add R suffix to device type (e.g., TLE2144CDWR). Chip forms are tested at TA = 25°C only.
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POST OFFICE BOX 655303
· DALLAS, TEXAS 75265
TLE214x, TLE214xA, TLE214xY EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS
SLOS183A FEBRUARY 1997 REVISED MARCH 1998
TLE2141 D, JG, OR P PACKAGE (TOP VIEW)
TLE2142 PW PACKAGE (TOP VIEW)
TLE2142 D, JG, OR P PACKAGE (TOP VIEW)
OFFSET N1 IN IN + VCC
1 2 3 4
8 7 6 5
NC VCC + OUT OFFSET N2
TLE2141 FK PACKAGE (TOP VIEW)
NC 1OUT 1OUT 1IN 1IN+ VCC VCC NC
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10 9
NC VCC+ VCC+ 2OUT 2IN 2IN+ 2IN+ NC
1OUT 1IN 1IN + VCC
1 2 3 4
8 7 6 5
VCC + 2OUT 2IN 2IN +
TLE2142 FK PACKAGE (TOP VIEW)
NC OFFSET N1 NC NC NC
TLE2144 DW PACKAGE (TOP VIEW)
NC VCC NC OFFSET N2 NC
TLE2144 J OR N PACKAGE (TOP VIEW)
1OUT 1IN 1IN + VCC + 2IN + 2IN 2OUT NC
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10 9
4OUT 4IN 4IN + VCC 3IN + 3IN 3OUT NC
1OUT 1IN 1IN + VCC + 2IN + 2IN 2OUT
1 2 3 4 5 6 7
14 13 12 11 10 9 8
4OUT 4IN 4IN + VCC 3IN + 3IN 3OUT
1IN + NC VCC + NC 2IN +
4 5 6 7 8
3 2 1 20 19 18 17 16 15 14 9 10 11 12 13
1IN 1OUT NC 4OUT 4IN
NC VCC NC 2IN + NC
TLE2144 FK PACKAGE (TOP VIEW)
NC IN NC IN + NC
4 5 6 7 8
3 2 1 20 19 18 17 16 15 14 9 10 11 12 13
NC VCC + NC OUT NC
NC 1IN NC 1IN + NC
4 5 6 7 8
3 2 1 20 19 18 17 16 15 14 9 10 11 12 13
NC 1OUT NC VCC + NC NC 2OUT NC 2IN NC 4IN + NC VCC NC 3IN +
NC No internal connection
POST OFFICE BOX 655303
· DALLAS, TEXAS 75265
2IN 2OUT NC 3OUT 3IN
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TLE214x, TLE214xA, TLE214xY EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS
SLOS183A FEBRUARY 1997 REVISED MARCH 1998
symbol
OFFSET N1 (see Note A) IN + IN OFFSET N2 (see Note A) NOTES: A. OFFSET N1 AND OFFSET N2 are only availiable on the TLE2241x devices. + OUT
TLE2141Y chip information
This chip, when properly assembled, displays characteristics similar to the TLE2141. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(7)
(6) OFFSET N1 IN + IN (5) OFFSET N2 (5) (1) (3) (2)
VCC+ (7) + (4) VCC (6) OUT
64
CHIP THICKNESS: 15 TYPICAL (1) BONDING PADS: 4 × 4 MINIMUM TJmax = 150°C (4) (2) (3) TOLERANCES ARE ± 10%. ALL DIMENSIONS ARE IN MILS.
65
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POST OFFICE BOX 655303
· DALLAS, TEXAS 75265
TLE214x, TLE214xA, TLE214xY EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS
SLOS183A FEBRUARY 1997 REVISED MARCH 1998
TLE2142Y chip information
This chip, when properly assembled, displays characteristics similar to the TLE2142. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS VCC+ (8) + + (4) VCC (5) (6) 2IN + 2IN
(2)
(1)
(8)
(7)
1IN + 1IN 2OUT
(3) (2) (7)
(1)
1OUT
90
CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM (3) (6) TJmax = 150°C TOLERANCES ARE ± 10%. ALL DIMENSIONS ARE IN MILS. (4) 80 (5) PIN 4 IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP.
POST OFFICE BOX 655303
· DALLAS, TEXAS 75265
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Others parts begin by tl
TL-1 TL-2 TL-3 TL-4 TL-5 TL-6 TL-7 TL-8 TL-9 TL-10 TL-11 TL-12 TL-13 TL-14 TL-15 TL-16 TL-17 TL-18 TL-19 TL-20 TL-21 TL-22 TL-23 TL-24 TL-25 TL-26 TL-27 TL-28 TL-29 TL-30 TL-31 TL-32 TL-33 TL-34 TL-35 TL-36 TL-37 TL-38 TL-39 TL-40 TL-41 TL-42 TL-43 TL-44 TL-45 TL-46 TL-47 TL-48 TL-49 TL-50 TL-51 TL-52 TL-53 TL-54 TL-55 TL-56
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