Details, datasheet, quote on part number: TLV2773CN
PartTLV2773CN
CategoryAnalog & Mixed-Signal Processing => Amplifiers => Operational Amplifiers
Descriptionti TLV2773, Dual 2.7-V High-slew-rate Rail-to-rail Output Operational Amplifier W/shutdown
CompanyTexas Instruments, Inc.
DatasheetDownload TLV2773CN datasheet
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Features, Applications

TLV277x, TLV277xA FAMILY OF 2.7-V HIGH-SLEW-RATE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN

High Slew Rate. 10.5 V/s Typ High-Gain Bandwidth. 5.1 MHz Typ Supply Voltage Range 5.5 V Rail-to-Rail Output 360 V Input Offset Voltage Low Distortion Driving 600- 0.005% THD+N 1 mA Supply Current (Per Channel) 17 nV/Hz Input Noise Voltage

2 pA Input Bias Current Characterized From to 125C Available in MSOP and SOT-23 Packages Micropower Shutdown Mode. IDD 1 A Available in Q-Temp Automotive High Reliability Automotive Applications Configuration Control / Print Support Qualification to Automotive Standards

description

The TLV277x CMOS operational amplifier family combines high slew rate and bandwidth, rail-to-rail output swing, high output drive, and excellent dc precision. The device provides 10.5 V/s of slew rate and 5.1 MHz of bandwidth while only consuming mA of supply current per channel. This ac performance is much higher than current competitive CMOS amplifiers. The rail-to-rail output swing and high output drive make these devices a good choice for driving the analog input or reference of analog-to-digital converters. These devices also have low distortion while driving a 600- load for use in telecom systems. These amplifiers have a 360-V input offset voltage, a 17 nV/Hz input noise voltage, and a 2-pA input bias current for measurement, medical, and industrial applications. The TLV277x family is also specified across an extended temperature range to 125C), making it useful for automotive systems, and the military temperature range to 125C), for military systems. These devices operate from to 5.5-V single supply voltage and are characterized 2.7 V and 5 V. The single-supply operation and low power consumption make these devices a good solution for portable applications. The following table lists the packages available.

FAMILY PACKAGE TABLE DEVICE TLV2774 TLV2775 NUMBER OF CHANNELS PACKAGE TYPES SHUTDOWN PDIP CDIP 8 SOIC SOT-23 5 TSSOP 14 16 MSOP 8 10 LCCC 20 CPAK 10 Yes Refer to the EVM Selection Guide (Lit# SLOU060) UNIVERSAL EVM BOARD

A SELECTION OF SINGLE-SUPPLY OPERATIONAL AMPLIFIER PRODUCTS DEVICE TLV247X TLV245X VDD (V) BW (MHz) SLEW RATE (V/s) IDD (per channel) (A) RAIL-TO-RAIL O I/O

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.

This document contains information on products in more than one phase of development. The status of each device is indicated on the page(s) specifying its electrical characteristics.

TLV2770 and TLV2771 AVAILABLE OPTIONS to 70C VIOmax AT 25C (mV) 125C 1.6 PACKAGED DEVICES SMALL OUTLINE (D) TLV2771AID SOT-23 (DBV) TLV2771CDBV TLV2771IDBV MSOP (DGK) TLV2770CDGK TLV2770IDGK PLASTIC DIP (P) TLV2770IP TLV2770AIP

This device is in the Product Preview stage of development. Please contact your local TI sales office for availability. TLV2772 and TLV2773 AVAILABLE OPTIONS to 70C VIOmax AT 25C (mV) 125C 1.6 PACKAGED DEVICES SMALL OUTLINE (D) TLV2772AID TLV2773AID MSOP (DGK) TLV2772CDGK TLV2772IDGK MSOP (DGS) TLV2773CDGS TLV2773IDGS PLASTIC DIP (N) TLV2773IN TLV2773AIN PLASTIC DIP (P) TLV2772IP TLV2772AIP

TLV2774 and TLV2775 AVAILABLE OPTIONS to 70C VIOmax AT 25C (mV) 125C 2.1 PACKAGED DEVICES SMALL OUTLINE (D) TLV2774AID TLV2775AID PLASTIC DIP (N) TLV2775IN TLV2775AIN PLASTIC DIP (P) TLV2774IP TLV2774AIP TSSOP (PW) TLV2774AIPW TLV2775AIPW

TLV2772M/Q AND TLV2772AM/Q AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C (mV) SMALL OUTLINE (D) TLV2772MD TLV2772AMD CHIP CARRIER (FK) TLV2772MFK TLV2772AMFK CERAMIC DIP (JG) TLV2772MJG TLV2772AMJG CERAMIC FLATPACK (U) TLV2772MU TLV2772AMU TSSOP (PW) TLV2772QPW TLV2772AQPW

PACKAGE SYMBOLS PACKAGE TYPE SOT23 PINS 5 Pin PART NUMBER TLV2770CDGK 8 Pin MSOP 10 Pin xx represents the device date code. TLV2773CDGS TLV2773IDGS SYMBOL VAMC VAMI xxTIABO xxTIABP xxTIAAF xxTIAAG xxTIABQ xxTIABR


 

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