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Details, datasheet, quote on part number:TPS9104IPT
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Datasheet text preview:
TPS9104 CELLULAR SUBSCRIBER TERMINAL POWER SUPPLY/AUDIO SYSTEM
SLVS133A AUGUST 1996 REVISED APRIL 1998
D D D D D D D D D D D
description
NC No internal connection
The TPS9104 incorporates a complete power supply and audio power system for a cellular subscriber terminal that uses battery packs with three or four NiMH/NiCd cells or a single lithium-ion cell. The device includes three low-dropout linear regulators rated for 3.3 V or 3 V at 100 mA each, a charge-pump driver, two power amplifiers for a speaker and a ringer, a low-noise microphone amplifier, and logic that includes a 250-ms reset, on/off control, and processor interface. Regulators A and B and the charge-pump driver are disabled until regulator L (logic regulator) reaches the rated voltage and RESET is logic high. Regulators A and B, the charge-pump driver, and the amplifiers have separate enables allowing circuitry to be powered up or down as necessary to conserve battery power. Each of the amplifiers has a depop circuit to prevent objectionable noise when the IC is powered up or when the amplifiers are enabled. Both the speaker amplifier and the ringer amplifier are designed to supply 2 V peak-to-peak into 32 or into a 90-nF piezoelectric speaker. The microphone amplifier is a low-noise high-gain (AV=100) circuit capable of supplying 3 V peak-to-peak into a 10-k load. The TPS9104 operates over a free-air temperature range of 40°C to 85°C and is supplied in a 48-pin TQFP package.
AVAILABLE OPTIONS PACKAGED DEVICE TA 40°C to 85°C THIN QFP (PT) TPS9104IPT CHIP FORM FORM (Y) TPS9104Y
The PT package is available taped and reeled. Add R suffix to the device type when ordering (e.g. TPS9104IPTR).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 1998, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
· DALLAS, TEXAS 75265
CP EN_CP GND ON_REM NC MIC_OUT MIC_IN NC MIC_IN+ REF VA CA
Complete Power-Supply/Audio System For Cellular Handsets Three Low-Dropout Regulators (LDOs) with 100-mV Dropout Speaker and Ringer Power Amplifiers Drive 32- Dynamic Speakers or Piezo Devices Low-Noise Microphone Amplifier Depop Protection For All Amplifiers Less Than 1 µA Supply Current in Shutdown, Typical 250-ms Microprocessor Reset Output 10-mA Charge-Pump Driver Configurable For Inverted or Doubled Output Separate Enables for LDOs, Amplifiers, and Charge Pump 1.185-V Reference Capable of Driving 2 mA 48-Pin TQFP Package
PT PACKAGE (TOP VIEW) ON SPKR_EN CL VL NC SPKR_IN SPKR_OUT NC VCC SPKR_OUT+ VB CB
48 47 46 45 44 43 42 41 40 39 38 37
GND VCC PL RNGR_OUT+ RNGR_OUT RNGR_IN RNGR_EN RESET NC AREF VCP GND_CP
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
36 35 34 33 32 31 30 29 28 27 26 25
GND EN_B PB OFF ON VCC NC EN PA MIC_EN EN_A GND
1
TPS9104 CELLULAR SUBSCRIBER TERMINAL POWER SUPPLY/AUDIO SYSTEM
SLVS133A AUGUST 1996 REVISED APRIL 1998
functional block diagram
VCP VCC 3 Charge Pump Driver CP GND_CP EN_CP VB 1 CB PB VA 1 CA PA VL 1 CL PL
EN Voltage Reference LDO Regulator B
REF
UVLO and OTP EN_A
LDO Regulator A
EN_B
LDO Regulator L
Reset Generator RESET
OFF ON ON_REM SPKR_IN SPKR_OUT+ SPKR_OUT SPKR_EN GND RNGR_OUT+ RNGR_OUT RNGR_EN 4 RNGR_IN MIC_IN+ + _ + _ MIC_IN MIC_OUT MIC_EN UVLO - Undervoltage lockout OTP - Overtemperature protection _ +
ON
AREF
2
POST OFFICE BOX 655303
· DALLAS, TEXAS 75265
TPS9104 CELLULAR SUBSCRIBER TERMINAL POWER SUPPLY/AUDIO SYSTEM
SLVS133A AUGUST 1996 REVISED APRIL 1998
TPS9104Y chip information
These chips, when properly assembled, display characteristics similar to the TPS9104. Thermal compression or ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS 36 35 34 33 32 31 29 28 27 26 25
37 38 39
24 CHIP THICKNESS: 15 TYPICAL 23 22 21 19 18 16 BONDING PADS: 3.3 × 3.3 MINIMUM TJ max = 150°C TOLERANCES ARE ± 10%.
40 42 138 43 45 46 47 48
ALL DIMENSIONS ARE IN MILS.
15 14 13
1
2
3
4
5
6 138
7
8
10
11
12
POST OFFICE BOX 655303
· DALLAS, TEXAS 75265
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