Details, datasheet, quote on part number: UCC27424D
CategorySemiconductors => Power Management => MOSFET and IGBT Gate Drivers => Low-side Driver
Part familyUCC27424 Dual 4A MOSFET Driver
TitleMOSFET and Power Drivers
DescriptionDual 4A MOSFET Driver 8-SOIC -40 to 105
CompanyTexas Instruments, Inc.
DatasheetDownload UCC27424D datasheet
Cross ref.Similar parts: MAX4427CSA, TC4424COA, TC4427COA, MIC4424BM, MIC4427BM, MC33152D, MC34152D, TSC627CSA, TC1427COA, TC427COA
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Input ThresholdCMOS,TTL
Channel Input LogicNon-Inverting
FeaturesEnable Pin
Fall Time(ns)15
Operating Temperature Range(C)-40 to 105
Approx. Price (US$)0.75 | 1ku
Input Negative Voltage(V)0
Number of Channels(#)2
Package GroupMSOP-PowerPAD,PDIP,SOIC
Peak Output Current(A)4
Input VCC(Max)(V)15
Input VCC(Min)(V)4
Prop Delay(ns)25
Rise Time(ns)20
  Mecanical Data
Pin nbPackage typeInd stdJEDEC codePackage qtyCarrierDevice markWidth (mm)Length (mm)Thick (mm)Pitch (mm)
8DSOICR-PDSO-G75TUBE27424 3.914.91.581.27
Spice Model
UCC27424 TINA-TI Transient Model - ZIP (09/16/2014)
UCC27424 Unencrypted PSpice Transient Model - ZIP (02/17/2016)
UCC27424 PSpice Transient Model - ZIP (07/11/2012)


Features, Applications


FEATURES D Industry-Standard Pin-Out D Enable Functions for Each Driver D High Current Drive Capability A D Unique BiPolar and CMOS True Drive Output

Stage Provides High Current at MOSFET Miller Thresholds TTL/CMOS Compatible Inputs Independent of Supply Voltage 20-ns Typical Rise and 15-ns Typical Fall Times with 1.8-nF Load Typical Propagation Delay Times 25 ns with Input Falling and 35 ns with Input Rising to 15-V Supply Voltage Supply Current 0.3 mA Dual Outputs Can Be Paralleled for Higher Drive Current Available in Thermally Enhanced MSOP PowerPADTM Package with 4.7C/W jc Rated From to 105C


The UCC27423/4/5 family of high-speed dual MOSFET drivers can deliver large peak currents into capacitive loads.Three standard logic options are offered dual-inverting, dual-noninverting and one-inverting and one-noninverting driver. The thermally enhanced 8-pin PowerPADTM MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability. It is also offered in the standard SOIC-8 (D) or PDIP-8 (P) packages. Using a design that inherently minimizes shoot-through current, these drivers deliver 4-A of current where it is needed most at the Miller plateau region during the MOSFET switching transition. A unique BiPolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages. The UCC27423/4/5 provides enable (ENBL) functions to have better control of the operation of the driver applications. ENBA and EBBB are implemented on pins 1 and 8 which were previously left unused in the industry standard pin-out. They are internally pulled up to Vdd for active high logic and can be left open for standard operation.

APPLICATIONS D Switch Mode Power Supplies D DC/DC Converters D Motor Controllers D Line Drivers D Class D Switching Amplifiers

PowerPADt is a trademark of Texas Instruments Incorporated. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

OUTPUT CONFIGURATION Dual inverting Dual nonInverting One inverting, one noninverting TEMPERATURE RANGE to +105C PACKAGED DEVICES SOIC-8 (D) UCC27425D MSOP-8 PowerPAD (DGN)} UCC27425DGN PDIP-8 (P) UCC27424P UCC27425P

D (SOIC-8) and DGN (PowerPAD-MSOP) packages are available taped and reeled. Add R suffix to device type (e.g. UCC27424DGNR) to order quantities of 2,500 devices per reel for or 1,000 devices per reel for DGN package. The PowerPAD is not directly connected to any leads of the package. However, it is electrically and thermally connected to the substrate which is the ground of the device. D, DGN, OR P PACKAGE (TOP VIEW) UCC27423 ENBA 1 INA 2 GND 3 INB 4 8 ENBB 7 OUTA 6 VDD 5 OUTB ENBA 1 INA 2 GND 3 INB 4 D, DGN, OR P PACKAGE (TOP VIEW) UCC27424 8 ENBB 7 OUTA 6 VDD 5 OUTB ENBA 1 INA 2 GND 3 INB 4 D, DGN, OR P PACKAGE (TOP VIEW) UCC27425 8 ENBB 7 OUTA 6 VDD 5 OUTB

PACKAGE SOIC-8 PDIP-8 MSOP PowerPAD-8 See Note 3 SUFFIX D P DGN jc (C/W) 4.7 ja (C/W) Power Rating (mW) = 70C See Note 1 344-655 See Note 500 1370 Derating Factor Above 70C (mW/5C) See Note See Note 9 17.1

Notes: 1. 125C operating junction temperature is used for power rating calculations 2. The range of values indicates the effect of pc-board. These values are intended to give the system designer an indication of the best and worst case conditions. In general, the system designer should attempt to use larger traces on the pc-board where possible in order to spread the heat away form the device more effectively. For information on the PowerPADt package, refer to Technical Brief, PowerPad Thermally Enhanced Package, Texas Instrument s Literature No. SLMA002 and Application Brief, PowerPad Made Easy, Texas Instruments Literature No. SLMA004. 3. The PowerPAD is not directly connected to any leads of the package. However, it is electrically and thermally connected to the substrate which is the ground of the device.

absolute maximum ratings over operating free-air temperature (unless otherwise noted)}

Supply voltage, VDD. 16 V Output current (OUTA, OUTB) DC, IOUT_DC. 0.3 A Pulsed, (0.5 s), IOUT_PULSED. 4.5 A Input voltage (INA, INB), VIN. or VDD+0.3 (whichever is larger) Enable voltage (ENBA, ENBB). or VDD+0.3 (whichever is larger) Power dissipation = 25C (DGN package). W (D package). mW (P package). 350 mW Junction operating temperature, TJ. to 150C Storage temperature, Tstg. to 150C Lead temperature (soldering, 10 sec.),. 300C

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to GND. Currents are positive into, negative out of the specified terminal.

PARAMETER Input (INA, INB) VIN_H, logic 1 input threshold VIN_L, logic 0 input threshold Input current Output (OUTA, OUTB) Output current VOH, high-level output voltage VOL, low-level output level Output resistance high

TEST CONDITION MIN VIN VDD 14 V, See Note 1, VOH = VDD VOUT, IOUT = 25C, See Note TA = full range, See Note 3 Output resistance low = 25C, See Note TA = full range See Note 3 Latch-up protection See Note 1 IOUT = -10 mA, IOUT = -10 mA, IOUT = 10 mA, IOUT = 10 mA, VDD 14 V, VDD 14 V, VDD 14 V, VDD 14 V, See Note 2 IOUT -10 mA TYP MAX UNITS mV mA

NOTES: 1. Ensured by design. Not tested in production. 2. The pullup / pulldown circuits of the driver are bipolar and MOSFET transistors in parallel. The pulsed output current rating is the combined current from the bipolar and MOSFET transistors. 3. The pullup / pulldown circuits of the driver are bipolar and MOSFET transistors in parallel. The output resistance is the RDS(ON) of the MOSFET transistor when the voltage on the driver output is less than the saturation voltage of the bipolar transistor.


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