|Category||Memory => Flash => NAND Flash|
|Description||Org. = 32M X 8 ;; Status = Available ;; Replacement = ;; Package = Tsop-i 48 Pins ;; Voltage = 2.7V to 3.6V ;; Page Size = 528 Bytes ;; Block Size = 16K Bytes|
|Company||Toshiba America Electronic Components, Inc.|
|Datasheet||Download TC58DVM82A1FTI0 datasheet
|TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS
The device 256-Mbit (276,824,064) bit NAND Electrically Erasable and Programmable Read-Only Memory (NAND E2PROM) organized as 528 bytes u 32 pages u 2048 blocks. The device uses single power supply 3.6 V for VCC). The device has a 528-byte static register which allows program and read data to be transferred between the register and the memory cell array in 528-byte increments. The Erase operation is implemented in a single block unit (16 Kbytes + 512 bytes: 528 bytes x 32 pages). The device is a serial-type memory device which utilizes the I/O pins for both address and data input/output as well as for command inputs. The Erase and Program operations are automatically executed making the device most suitable for applications such as solid-state file storage, voice recording, image file memory for still cameras and other systems which require high-density non-volatile memory data storage.FEATURES
x Organization Memory cell allay u 8 Register u 8 Page size 528 bytes Block size (16K 512) bytes x Modes Read, Reset, Auto Page Program Auto Block Erase, Status Read x Mode control Serial input/output Command control x Power supply Vcc: 3.6V x Program/Erase Cycles 1E5 cycle (with ECC) x Access time Cell array to register 25 Ps max Serial Read Cycle 50 ns min x Operating current Read (50 ns cycle) 10 mA typ. Program (avg.) 10 mA typ. Erase (avg.) 10 mA typ. Standby 50 PA max. x Package TSOP 48-P-1220-0.50 (Weight:0.53g typ)
xTOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. xThe TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. xThe products described in this document are subject to the foreign exchange and foreign trade laws. xThe information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. xThe information contained herein is subject to change without notice.
Write enable Read enable Command latch enable Address latch enable Write protect Ready/Busy Ground input Power supply I/O port Power supply Ground
SYMBOL VCC VCCQ VIN VI/O PD Tsolder Tstg Topr RATING Power Supply Voltage I/O port Power Supply Voltage Input Voltage for Control pins Input/Output Voltage for I/O pins Power Dissipation Soldering Temperature(10s) Storage Temperature Operating Temperature VALUEThis parameter is periodically sampled and is not tested for every device.
|Some Part number from the same manufacture Toshiba America Electronic Components, Inc.|
|TC58DVM82A1XBJ1 Org. = 32M X 8 ;; Status = Contact Marketing ;; Replacement = ;; Package = TFBGA-56 ;; Voltage = 2.7V to 3.6V ;; Page Size = 528 Bytes ;; Block Size = 16K Bytes|
|TC58DVM82F1FT00 Org. = 32M X 8 ;; Status = Available ;; Replacement = ;; Package = Tsop-i 48 Pins ;; Voltage = 2.7V to 3.6V ;; Page Size = 528 Bytes ;; Block Size = 16K Bytes|
|TC58DVM92A1FT00 Org. = 64M X 8 ;; Status = Available ;; Replacement = ;; Package = Tsop-i 48 Pins ;; Voltage = 2.7V to 3.6V ;; Page Size = 528 Bytes ;; Block Size = 16K Bytes|
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|TC58FVB160AFT Organization = 2Mx8 / 1Mx16 ;; Pkg-pins = TSOP-I-48,TFGBA ;; Speed = 70ns/100ns ;; VCC = 2.7-3.6 ;; Read Icc Max (mA) = 30 ;; Standby Icc Max (uA) = 10 ;; Boot Block = Bottom ;; Comment =|
|TC58FVB160AXB Organization = 2Mx8 / 1Mx16 ;; Pkg-pins = TSOP-I-48,TFGBA ;; Speed = 70ns/100ns ;; VCC = 2.7-3.6 ;; Read Icc Max (mA) = 30 ;; Standby Icc Max (uA) = 10 ;; Boot Block = Bottom ;; Comment =|
|TC58FVB160FT-10 16-mbit ( 2m X 8 Bits/1m X 16 Bits ) CMOS Flash Mimory|
|TC58FVB321FT Organization = 4Mx8 / 2Mx16 ;; Pkg-pins = TSOP-I-48,TFBGA ;; Speed = 70ns/100ns ;; VCC = 2.7-3.6 ;; Read Icc Max (mA) = 30 ;; Standby Icc Max (uA) = 10 ;; Boot Block = Bottom ;; Comment = Recommend Shrink|
|TC58FVB321XB Organization = 4Mx8 / 2Mx16 ;; Pkg-pins = TSOP-I-48,TFBGA ;; Speed = 70ns/100ns ;; VCC = 2.7-3.6 ;; Read Icc Max (mA) = 30 ;; Standby Icc Max (uA) = 10 ;; Boot Block = Bottom ;; Comment = Recommend Shrink|
|TC58FVB641FT Organization = 8Mx8 / 4Mx16 ;; Pkg-pins = TSOP-I-48,TFBGA ;; Speed = 70ns/100ns ;; VCC = 2.7-3.6 ;; Read Icc Max (mA) = 30 ;; Standby Icc Max (uA) = 10 ;; Boot Block = Bottom ;; Comment = Recommend Shrink|
|TC58FVB641FT-10 64-mbit ( 8m 8 Bits / 4m 16 Bits ) CMOS Flash Memory|
|TC58FVB641XB Organization = 8Mx8 / 4Mx16 ;; Pkg-pins = TSOP-I-48,TFBGA ;; Speed = 70ns/100ns ;; VCC = 2.7-3.6 ;; Read Icc Max (mA) = 30 ;; Standby Icc Max (uA) = 10 ;; Boot Block = Bottom ;; Comment = Recommend Shrink|
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KM718V789AT : SB & SPB. = KM718V789AT 128Kx18-Bit Synchronous Pipelined Burst SRAM ;; Organization = 128Kx18 ;; Operating Mode = SPB ;; VDD(V) = 3.3 ;; Access Time-tCD(ns) = 3.1,3.1,3.1,3.5,3.8,4.0 ;; Speed-tcyc (MHz) = 225,200,183,167,150,138 ;; I/o Voltage(V) = 2.5,3.3 ;; Package = TQFP ;; Production Status = Eol ;; Comments = Design is Not Recommended.
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SST39LF200A-45-4C-B3K : Multi-Purpose Flash (MPF). Voltage = 3 to 3.6 ;; Density = 2Mb ;; Organization = 128Kb X 16 ;; Speed = 45 NS ;; Temp. = Commercial ;; Package = Tfbga/tbga.
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