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Part: 292D105X_010R2
Category:
Description: Solid Tantalum Chip Capacitors, Tantamount Leadless Molded
Company: Vishay Intertechnology
Datasheet: Download 292D105X_010R2 datasheet File size : 343 kB
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Datasheet text preview:
292D
Vishay Sprague
Solid Tantalum Chip Capacitors, Tantamount® Leadless Molded
FEATURES
· 0805 Footprint · 1.2mm and 1.55mm Max. Height · Wraparound tin terminations · 8mm tape and reel packaging available per EIA-481-1 and reeling per IEC 286-3. 7" [178mm] standard. 13" [330mm] available.
PERFORMANCE CHARACTERISTICS
Operating Temperature: - 55°C to + 85°C (To + 125°C voltage derating) Capacitance Range: 1.0µF to 47µF Capacitance Tolerance: ± 10%, ± 20% standard Voltage Rating: 4WVDC to 10WVDC
ORDERING INFORMATION
292D MODEL
106 CAPACITANCE
X_ CAPACITANCE TOLERANCE X0 = ± 20% X9 = ± 10%
010 DC VOLTAGE RATING @ + 85°C This is expressed in volts. To complete the three-digit block, zeros precede the voltage rating. A decimal point is indicated by an "R" (6R3 = 6.3 volts).
P CASE CODE See Ratings and Case Codes Table.
2 TERMINATION 2 = Solderable coating. Standard. 4 = Gold plated 8 = Solder Plated (60/ 40) Special Order.
_ REEL SIZE AND PACKAGING T = Tape and reel* 7" [178mm] reel W =13" [330mm] reel *Cathode nearest sprocket hole.
This is expressed in picofarads. The first two digits are the significant figures. The third is the number of zeros to follow.
Note: Preferred Tolerance and Reel size are in bold.
DIMENSIONS in inches [millimeters]
Tantalum Wire Nib Identifies Anode (+) Terminal P
L
P H W
CASE R P
EIA 0805 [2012] 0805 [2012]
L 0.079 ± 0.008 [2.0 ± 0.2] 0.079 ± 0.010 [2.0 ± 0.25]
W 0.051 ± 0.008 [1.3 ± 0.2] 0.053 ± 0.008 [1.35 ± 0.2]
H 0.047 (Max.) [1.2 Max.] 0.053 ± 0.008 [1.35 ± 0.2]
P 0.020 ± 0.012 [0.5 ± 0.3] 0.020 ± 0.012 [0.5 ± 0.3]
Document Number: 40042 Revision 13-Nov-03
For technical questions, contact tantalum@vishay.com
www.vishay.com 9
292D
Vishay Sprague
RATINGS AND CASE CODES
3V 4V 1 2.2 3.3 4.7 6.8 R 10 R 15 R 22 P/R 33 P 47 P *Preliminary values, contact factory for availability.
µF
6.3V R R R R R P/R* P
10V
16V R R R P
20V R R
P/R P/R P/R P/R P
STANDARD RATINGS
MAX MAX DF MAX ESR DCL @ + 25°C @ 100K Hz @ +25°C (%) () (µA) 3WVDC @ + 85°C, SURGE = 3.9V. . .1.9WVDC @ + 125°C, SURGE = 2.9V 47 P 292D476X_003P2T 1.5 12 6 4WVDC @ + 85°C, SURGE = 5.2V. . .2.7WVDC @ + 125°C, SURGE = 3.4V 6.8 R 292D685X_004R2T 0.5 6 5.5 10 R 292D106X_004R2T 0.5 6 5.1 15 R 292D156X_004R27 0.8 8 3.5 22 P 292D226X_004P2T 0.9 8 3.5 22 R 292D226X_004R2T 0.9 10 3.5 33 P 292D336X_004P2T 1.3 10 3.5 6.3WVDC @ + 85°C, SURGE = 8V. . .4WVDC @ + 125°C, SURGE = 5V 2.2 R 292D225X_6R3R2T 0.14 10 3.0 4.7 R 292D475X_6R6R2T 0.6 6 3.4 6.8 R 292D685X_6R3R2T 0.5 6 5 10 R 292D106X_6R3R2T 0.9 10 3.5 15 R 292D156X_6R3R2T 0.9 10 3.5 15 R 292D15X_6R3R2_035 0.9 10 1.8 22 P 292D226X_6R3P2T 1.3 10 3.5 22 P 292D226X_6R3P2_035 0.9 10 1.1 22* R* 292D226X_6R3R2T* 0.9* 10* 3.5* 33 P 292D336X_6R3P2T 2.1 10 3.5 10WVDC @ + 85°C, SURGE = 13V. . .7WVDC @ + 125°C, SURGE = 8V 1 R 292D105X_010R2 0.5 4 9.6 3.3 R 292D335X_010R2T 0.5 8 2.0 3.3 R 292D335X_010R2_035 0.5 8 1.0 3.3 P 292D335X_010P2T 0.5 8 2.0 4.7 P 292D475X_010P2T 0.5 8 5.0 4.7 R 292D475X_010R2T 0.5 8 5.0 6.8 P 292D685X_010P2T 0.7 8 2.0 6.8 R 292D685X_010R2T 0.7 8 2.0 10 P 292D106X_010P2T 1.0 8 2.0 10 R 292D106X_010R2T 1.0 8 2.0 15 P 292D156X_010P2T 1.5 8 3.5 15 P 292D156X_010P2_035 1.5 8 1.1 16WVDC @ + 85°C, SURGE = 20V. . .10WVDC @ + 125°C, SURGE = 12V 1 R 292D105X_016R2 0.5 4 9.3 2.2 R 292D225X_016R2T 0.35 8 6 3.3 R 292D335X_016R2T 0.53 8 6 3.3 R 292D335X_016R2_035 0.53 8 3 4.7 R 292D475X_016R2T 0.75 8 6 10 P 292D106X_016P2T 1.6 8 6 20WVDC @ + 85°C, SURGE = 26V. . .13WVDC @ + 125°C, SURGE = 16V 1.0 R 292D105X_020R2T 0.2 8 5.0 2.2 R 292D225X_020R2T 0.5 8 6.0 *Preliminary values, contact factory for availability. www.vishay.com 10 For technical questions, contact tantalum@vishay.com CAPACITANCE (µF) CASE CODE PART NUMBER MAX RIPPLE 100K Hz IRMS (AMPS) 0.21 0.067 0.070 0.085 0.085 0.085 0.085 0.091 0.086 0.071 0.085 0.085 0.118 0.118 0.151 0.085* 0.085 0.051 0.11 0.158 0.11 0.071 0.071 0.112 0.112 0.112 0.112 0.085 0.151 0.052 0.065 0.065 0.091 0.065 0.065 0.071 0.14
Document Number: 40042 Revision 13-Nov-03
292D
Vishay Sprague
PERFORMANCE CHARACTERISTICS
1. Operating Temperature: Capacitors are designed to operate over the temperature range of - 55°C to + 85°C. 6.1 Measurements shall be made by the bridge method at, or referred to, a frequency of 120Hz and a temperature of + 25°C. 7. Leakage Current: Capacitors shall be stabilized at the rated temperature for 30 minutes. Rated voltage shall be applied to capacitors for 5 minutes using a steady source of power (such as a regulated power supply) with 1000 ohm resistor connected in series with the capacitor under test to limit the charging current. Leakage current shall then be measured.
Note that the leakage current varies with applied voltage. See graph below for the appropriate adjustment factor.
1.1 Capacitors may be operated to + 125°C with voltage derating to two-thirds the + 85°C rating.
+ 85°C WORKING VOLTAGE (V) 4.0 6.3 10.0 SURGE VOLTAGE (V) 5.2 8.0 13.0 + 125°C RATING WORKING VOLTAGE (V) 2.7 4.0 7.0 SURGE VOLTAGE (V) 3.4 5.0 8.0
TYPICAL LEAKAGE CURRENT FACTOR RANGE
2.
DC Working Voltage: The DC working voltage is the maximum operating voltage for continuous duty at the rated temperature.
100
3.
Surge Voltage: The surge DC rating is the maximum voltage to which the capacitors may be subjected under any conditions, including transients and peak ripple at the highest line voltage.
10
+ 125°C + 85°C
3.1 Surge Voltage Test: Capacitors shall withstand the surge voltage applied in series with a 33 ohm ± 5% resistor at the rate of one-half minute on, one-half minute off, at + 85°C, for 1000 successive test cycles.
Leakage Current Factor
+ 55°C
+ 25°C 1.0 0°C
3.2 Following the surge voltage test, the dissipation factor and the leakage current shall meet the initial require ments; the capacitance shall not have changed more than ± 10%. 4. Capacitance Tolerance: The capacitance of all capacitors shall be within the specified tolerance limits of the normal rating.
0.1 - 55°C
4.1 Capacitance measurements shall be made by means of polarized capacitance bridge. The polarizing voltage shall be of such magnitude that there shall be no reversal of polarity due to the AC component. The maximum voltage applied to capacitors during measure ment shall be 2 volts rms at 120Hz at + 25°C. If the AC voltage applied is less than one-half volt rms, no DC bias is required. Accuracy of the bridge shall be within ± 2%. 5. Capacitance Change With Temperature: The capacitance change with temperature shall not exceed the following percentage of the capacitance measured at + 25°C: at
- 55°C - 10% + 85°C + 10% + 125°C + 12%
0.01
0.001 0 10 20 30 40 50 60 70 80 90 100 Percent of Rated Voltage
7.1 At + 25°C, the leakage current shall not exceed the value listed in the Standard Ratings Table. 7.2 At + 85°C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings Table. 7.3 At + 125°C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings Table.
6.
Dissipation Factor: The dissipation factor, determined from the expression 2fRC, shall not exceed values listed in the Standard Ratings Table.
Document Number: 40042 Revision 13-Nov-03
For technical questions, contact tantalum@vishay.com
www.vishay.com 11
292D
Vishay Sprague
PERFORMANCE CHARACTERISTICS (Continued)
8. ESR
GUIDE TO APPLICATION
1. A-C Ripple Current: The maximum allowable ripple current shall be determined from the formula: Irms = where, P RESR
8.1 ESR (Equivalent Series Resistance) shall not exceed the values listed in the Ratings Table. Measurement shall be made by the bridge method at a frequency of 100kHz and a temperature of + 25°C. 9. Life Test: Capacitors shall withstand rated DC voltage applied at + 85°C or two-thirds rated voltage applied at + 125°C for 2000 hours.
P = Power Dissipation in Watts @ + 25°C as given in the table in Paragraph Number 5 (Power Dissipation). RESR = The capacitor Equivalent Series Resistance at the specified frequency. 2. A-C Ripple Voltage: The maximum allowable ripple voltage shall be determined from the formula: Vrms = or, from the formula: where, Vrms = Irms x Z P RESR
9.1 Following the life test, the dissipation factor shall meet the initial requirement; the capacitance change shall not exceed ± 10%; the leakage current shall not exceed 125% of the initial requirement. 10 Solderability: Capacitors will meet the solderability requirements of (MIL-STD-202, method 208), ANSI/JSTD-002, Test B.
P = Power Dissipation in Watts @ + 25°C as given in the table in Paragraph Number 5 (Power Dissipation). RESR = The capacitor Equivalent Series Resistance at the specified frequency. Z = The capacitor impedance at the specified frequency. 2.1 The sum of the peak AC voltage plus the DC voltage shall not exceed the DC voltage rating of the capacitor. 2.2 The sum of the negative peak AC voltage plus the applied DC voltage shall not allow a voltage reversal exceeding 10% of the DC working voltage at + 25°C. 2.3 Temperature Derating: If these capacitors are to be operated at temperatures above + 25°C, the permissible rms ripple current or voltage shall be calculated using the derating factors as shown:
TEMPERATURE + 25°C DERATING FACTOR 1.0 0.9 0.4
11. Resistance to Solder Heat: Capacitors will withstand exposure to + 245°C + 5°C for 5 seconds. 11.1 F o l l o w i n g the resistance to solder heat test, capacitance, dissipation factor and DC leakage current shall meet the initial requirement. 12. Terminal Strength: Per IEC-384-3, minimum of 3N shear force. 13. Flammability: 14. Encapsulant materials meet UL94 V0 with an oxygen index of 32%. 15. Capacitor Failure Mode: The predominant failure mode for solid tantalum capacitors is increased leakage current resulting in a shorted circuit. Capacitor failure may result from excess forward or reverse DC voltage, surge current, ripple current, thermal shock or excessive temperature. The increase in leakage is caused by a b r e a k d o w n of the Ta 2O5 dielectric. For additional information on leakage failure of solid tantalum chip capacitors, refer to Vishay Sprague Technical Paper, " L e a k a g e Failure Mode in Solid Tantalum Chip Capacitors."
+ 85°C + 125°C
2.4 Power Dissipation: Power dissipation will be affected by the heat sinking capability of the mounting surface. Non-sinusoidal ripple current may produce heating effects which differ from those shown. It is important that the equivalent Irms value be established when calculating permissible operating levels. (Power Dissipation calculated using +25°C temperature rise.
CASE CODE MAXIMUM PERMISSIBLE POWER DISSIPATION @ + 25C (Watts) IN FREE AIR 0.025 0.025
P R
www.vishay.com 12
For technical questions, contact tantalum@vishay.com
Document Number: 40042 Revision 13-Nov-03
292D
Vishay Sprague
3. Reverse Voltage: These capacitors are capable of withstanding peak voltages in the reverse direction equal to 10% of the DC rating at + 25°C, 5% of the DC rating at + 85°C and 1% of the DC rating at +125°C Recommended rated working voltage guidelines:
APPLICATION VOLTAGE (V) 2.5 4.0 6.0 RECOMMENDED CAPACITOR VOLTAGE RATING (V) 4.0 6.3 10.0
4.
8. Recommended Mounting Pad Geometries: Proper mounting pad geometries are essential for successful solder connections. These dimensions are highly process sensitive and should be designed to minimize component rework due to unacceptable solder joints. The dimensional configurations shown are the recom mended pad geometries for both wave and reflow soldering techniques. These dimensions are intended to be a starting point for circuit board designers and may be fine tuned if necessary based upon the peculiarities of the soldering process and/or circuit board design.
REFLOW SOLDER PADS*
5. Printed Circuit Board Materials: The 292D is compatible with commonly used printed circuit board materials (alumina substrates, FR4, FR5, G10, PTFE- fluorocarbon and porcelanized steel). Attachment:
B C B in inches [millimeters)
6.
6.1 Solder Paste: The recommended thickness of the solder paste after application is .007" ± .001" [.178mm ± 0.025mm]. Care should be exercised in selecting the solder paste. The metal purity should be high as practical. The flux (in the paste) must be active enough to remove the oxides formed on the metallization prior to the exposure to soldering heat. In practice this can be aided by extending the solder preheat time at temperatures below the liquidous state of the solder. 6.2 Soldering: Capacitors can be attached by conventional soldering techniques - vapor phase, infrared reflow, wave soldering and hot plate methods. The Soldering Profile chart shows maximum recommended time/ temperature conditions for soldering. Attachment with a soldering iron is not recommended due to the difficulty of controlling temperature and time at temperature. If hand soldering is necessary, the soldering iron must never come in contact with the capacitor.
A
Case Code P/R
Width (A) .051 [1.5]
Pad Metallization (B) .02 [0.80]
Separation (C) .39 [1.0]
9.
REFLOW SOLDERING PROFILE
300 250 200 150 100 50 0 0 50 100 150 200
Time (Seconds)
Temperature Deg. Centigrade
300 245°C Typical 250 200 130°C Typical 150 100 50 0 250
Cleaning (Flux Removal) After Soldering: The 292D is compatible with all commonly used solvents such as TES, TMS, Prelete, Chlorethane, Terpene and aqueous cleaning media. However, CFC/ODS products are not used in the production of these devices and are not recommended. Solvents containing methylene chloride or other epoxy solvents should be avoided since these will attack the epoxy encapsulation material.
9.1 When using ultrasonic cleaning, the board may resonate if the output power is too high. This vibration can cause cracking or a decrease in the adherence of the termination. DO NOT EXCEED 9W/L @ 40kHz for 2 minutes.
Document Number: 40042 Revision 13-Nov-03
For technical questions, contact tantalum@vishay.com
www.vishay.com 13
Others parts begin by 29
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