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Details, datasheet, quote on part number:WF128K32
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| Part: | WF128K32 |
| Category: | Memory => Flash => Flash MCP |
| Description: | Organization = 128Kx32 ;; Speed (ns) = 50-150 ;; Volt = 5 ;; Package = 68 CQFP ;; Temp = C,i,m,q ;; |
| Company: | White Electronic Designs Corporation |
| Datasheet: | Download WF128K32 datasheet File size : 398 kB |
| Request For quote: | Find where to buy WF128K32
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Datasheet text preview:
White Electronic Designs
F E ATURES
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WF128K32-XXX5
128KX32 5V FLASH MODULE, SMD 5962-94716
Access Times of 50*, 60, 70, 90, 120, 150ns Packaging: 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) 68 lead, Hermetic CQFP (G2L), 22.4mm (0.880 inch) square, 4.06mm (0.160 inch) high (Pack age 528)
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n 100,000 Erase/Program Cycles Typical, 0°C to +70°C n n n n n
Organized as 128Kx32 Commercial, Industrial and Military Temperature Ranges 5 Volt Programming. 5V ± 10% Supply Embedded Erase and Program Algorithms TTL Compatible Inputs and CMOS Outputs Pins for Low Noise Operation Control Time
n Low Power CMOS, 1mA Standby Typical
n Built-in Decoupling Caps and Multiple Ground n Page Program Operation and Internal Program n
68 lead, Hermetic CQFP (G1U) , 23.9mm (0.940 inch) square, 3.56mm (0.140 inch) high (Package 519) 68 lead, Hermetic CQFP (G1T), 23.9mm (0.940 inch) square, 4.06mm (0.160 inch) high (Package 524)
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Sector Architecture 8 equal size sectors of 16KBytes each Any combination of sectors can be concurrently erased. Also supports full chip erase
Weight WF128K32-XG2LX5 - 8 grams typical WF128K32-XG1UX51 - 5 grams typical WF128K32-XG1TX5 - 5 grams typical WF128K32-XG2UX5 - 8 grams typical WF128K32-XH1X5 - 13 grams typical
Note 1: Package Not Recommended For New Design Note: For programming information refer to Flash Programming 1M5 Application Note. * The access time of 50ns is available in Industrial and Commercial temperature ranges only.
FIG. 1 PIN CONFIGURATION FOR WF128K32N-XH1X5
TOP VIEW
I/O24 I/O25 I/O26 A7 A12 NC A13 A8 I/O16 I/O17 I/O18 I/O8 I/O9 I/O10 A14 A16 A11 A0 NC I/O0 I/O1 I/O2 WE2 CS2 GND I/O11 A10 A9 A15 VCC CS1 NC I/O3 I/O15 I/O14 I/O13 I/O12 OE NC WE1 I/O7 I/O6 I/O5 I/O4 VCC CS4 WE4 I/O27 A4 A5 A6 WE3 CS3 GND I/O19 I/O31 I/O30 I/O29 I/O28 A1 A2 A3 I/O23 I/O22 I/O21 I/O20
PIN DESCRIPTION
I/O0-31 A0-16 WE 1 - 4 CS 1 - 4 OE VCC GND NC Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Not Connected
BLOCK DIAGRAM
May 2003 Rev. 6
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WF128K32-XXX5
FIG. 3 PIN CONFIGURATION FOR WF128K32-XG1UX51, WF128K32-XG1TX5 AND WF128K32-XG2UX5, WF128K32-XG2LX5
TOP VIEW
NC A0 A1 A2 A3 A4 A5 CS3 GND CS4 WE 1 A6 A7 A8 A9 A10 VCC
PIN DESCRIPTION
I/O 0-31 A0-16
I/O16 I/O17 I/O18 I/O19 I/O20 I/O21 I/O22 I/O23 GND I/O24 I/O25 I/O26 I/O27 I/O28 I/O29 I/O30 I/O31
Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Not Connected
9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61 I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 GND I/O8 I/O9 I/O10 I/O11 I/O12 I/O13 I/O14 I/O15 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
WE2 WE3 WE4 A16 CS1 OE
60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44
WE 1 - 4 CS 1 - 4 OE VCC GND NC
BLOCK DIAGRAM
CS2 NC
A11
A12
A13
A14
A15
VCC
NC NC
NC
Note 1: Package Not Recommended For New Design
White Electronic Designs Corporation Phoenix AZ (602) 437-1520
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White Electronic Designs
ABSOLUTE MAXIMUM RATINGS (1)
Parameter Unit Parameter
WF128K32-XXX5
RECOMMENDED OPERATING CONDITIONS
Symbol Min Max Unit
Operating Temperature Supply Voltage Range (VCC) Signal voltage range (any pin except A9) (2) Storage Temperature Range Lead Temperature (soldering, 10 seconds) Data Retention Mil Temp Endurance (write/erase cycles) Mil Temp A9 Voltage for sector protect (VID) (3)
-55 to +125 -2.0 to +7.0 -2.0 to +7.0 -65 to +150 +300 10 years 10,000 cycles min. -2.0 to +14.0
°C V V °C °C
Supply Voltage Input High Voltage Input Low Voltage Operating Temp. (Mil.) A9 Voltage for Sector Protect
V CC VIH V IL TA VID
4.5 2.0 -0.5 -55 11.5
5.5 V C C + 0.3 +0.8 +125 12.5
V V V °C V
CAPACITANCE
V
Parameter
(TA = +25ºC)
Symbol Conditions Max Unit
NOTES: 1. Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions, inputs may overshoot Vss to -2.0 V for periods of up to 20ns. Maximum DC voltage on output and I/O pins is Vcc + 0.5V. During voltage transitions, outputs may overshoot to Vcc + 2.0 V for periods of up to 20ns. 3. Minimum DC input voltage on A9 pin is -0.5V. During voltage transitions, A9 may overshoot Vss to -2V for periods of up to 20ns. Maximum DC input voltage on A9 is +13.5V which may overshoot to 14.0 V for periods up to 20ns.
OE capacitance WE1-4 capacitance HIP (PGA) CQFP G2U/G1U/G1T/G2L CS1-4 capacitance Data I/O capacitance Address input capacitance
COE CWE
VIN = 0 V, f = 1.0 MHz VIN = 0 V, f = 1.0 MHz
50 20 15
pF pF
CCS CI/O CAD
VIN = 0 V, f = 1.0 MHz VI/O = 0 V, f = 1.0 MHz VIN = 0 V, f = 1.0 MHz
20 20 50
pF pF pF
This parameter is guaranteed by design but not tested.
DC CHARACTERISTICS - CMOS COMPATIBLE
(VCC = 5.0V, VSS = 0V, TA = -55°C TO +125°C)
Parameter Symbol Conditions Min Max Unit
Input Leakage Current Output Leakage Current VCC Active Current for Read (1) VCC Active Current for Program or Erase (2) VCC Standby Current VCC Static Current Output Low Voltage Output High Voltage Output High Voltage Low VCC Lock Out Voltage
ILI ILOx32 ICC1 ICC2 ICC3 ICC4 VOL VOH1 VOH2 VLKO
VCC = 5.5, VIN = GND to VCC VCC = 5.5, VIN = GND to VCC CS = VIL, OE = VIH CS = VIL, OE = VIH VCC = 5.5, CS = VIH, f = 5MHz VCC = 5.5, CS = VIH IOL = 8.0 mA, VCC = 4.5 IOH = -2.5 mA, VCC = 4.5 IOH = -100 µA, VCC = 4.5 0.85 x VCC VCC -0.4 3.2
10 10 140 200 6.5 0.6 0.45
µA µA mA mA mA mA V V V V
NOTES: 1. The ICC current listed includes both the DC operating current and the frequency dependent component (at 5 MHz). The frequency component typically is less than 2 mA/MHz, with OE at VIH. 2. ICC active while Embedded Algorithm (program or erase) is in progress. 3. DC test conditions: VIL = 0.3V, VIH = VCC - 0.3V
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
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