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Details, datasheet, quote on part number:WS128K32-XG2LX
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| Part: | WS128K32-XG2LX |
| Category: | Memory => SRAM => MCPSRAM |
| Description: | Organization = 128Kx32 ;; Speed (ns) = 15-55 ;; Volt = 5 ;; Package = 68 CQFP ;; Temp = C,i,m,q ;; |
| Company: | White Electronic Designs Corporation |
| Datasheet: | Download WS128K32-XG2LX datasheet File size : 384 kB |
| Request For quote: | Find where to buy WS128K32-XG2LX
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Datasheet text preview:
White Electronic Designs
WS128K32-XXX
128Kx32 SRAM MODULE, SMD 5962-93187 & 5962-95595
FEATURES
! ! ! ! !
Access Times of 15, 17, 20, 25, 35, 45, 55ns MIL-STD-883 Compliant Devices Available Packaging · 66 pin, PGA Type, 1.075" square, Hermetic Ce ramic HIP (Package 400)
Commercial, Industrial and Military Temperature Ranges 5 Volt Power Supply TTL Compatible Inputs and Outputs Built in Decoupling Caps and Multiple Ground Pins for Low Noise Operation Weight: WS128K32-XG1UX1 - 5 grams typical WS128K32-XG1TX - 5 grams typical WS128K32-XG2UX - 8 grams typical WS128K32-XG2LX - 8 grams typical WS128K32-XH1X - 13 grams typical WS128K32-XG4TX1 - 20 grams typical All devices are upgradeable to 512Kx32
! Low Power CMOS ! ! !
· 68 lead, 40mm CQFP (G4T) , 3.56mm (0.140") (Package 502) · 68 lead, 22.4mm CQFP (G2U), 3.56mm (0.140"), (Package 510) · 68 lead, 22.4mm (0.880") square, CQFP (G2L), 5.08mm (0.200") high, (Package 528). · 68 lead, 23.9mm Low Profile CQFP (G1U)1, 3.57mm (0.140"), (Package 519) · 68 lead, 23.9mm Low Profile CQFP (G1T), 4.06 mm (0.160"), (Package 524) ! Organized as 128Kx32; User Configurable as 256Kx16 or 512Kx8
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Note 1: Package Not Recommended For New Design
FIG. 1 PIN CONFIGURATION FOR WS128K32N-XH1X
TOP VIEW PIN DESCRIPTION
I/O0-31 Data Inputs/Outputs A 0-16 WE1-4 CS1-4 OE VCC
13 6
Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Not Connected
GND
3 0
14
7
NC
15
11
4
1
BLOCK DIAGRAM
5 2 9
16
12
October 2003 Rev. 14
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White Electronic Designs Corporation · (602) 437-1520 · www.whiteedc.com
White Electronic Designs
FIG. 2 PIN CONFIGURATION FOR WS128K32-XG4TX1
TOP VIEW
WS128K32-XXX
PIN DESCRIPTION
I/O0-31 A0-16 WE C S1 - 4 OE VCC GND NC Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Not Connected
BLOCK DIAGRAM
Note 1: Package Not Recommended For New Design
FIG. 3 PIN CONFIGURATION FOR WS128K32-XG2UX, WS128K32-XG2LX, WS128K32-XG1TX AND
W S 1 2 8 K 3 2 - X G 1 U X1 TOP VIEW PIN DESCRIPTION
I/O0-31 A0-16 W E1 - 4 C S1 - 4 OE VCC GND NC Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Not Connected
BLOCK DIAGRAM
Note 1: Package Not Recommended For New Design
White Electronic Designs Corporation · (602) 437-1520 · www.whiteedc.com 2
White Electronic Designs
ABSOLUTE MAXIMUM RATINGS
Parameter Operating Temperature Storage Temperature Signal Voltage Relative to GND Junction Temperature Supply Voltage Symbol TA TSTG VG TJ VCC -0.5 Min -55 -65 -0.5 Max +125 +150 Vcc+0.5 150 7.0 Unit °C °C V °C V CS H L L L OE X L X H WE X H L H
WS128K32-XXX
TRUTH TABLE
Mode Standby Re a d Wr i t e O u t Disable Data I/O High Z D a t a Out D a t a In High Z Power Standby Active Active Active
RECOMMENDED OPERATING CONDITIONS
Parameter Supply Voltage Input High Voltage Input Low Voltage Operating Temp. (Mil.) Symbol VCC VIH VIL TA Min 4.5 2.2 -0.3 -55 Max 5.5 V C C + 0.3 +0.8 +125 Unit V V V °C
CAPACITANCE (TA = +25°C)
Parameter OE capacitance WE1-4 capacitance HIP (PGA) H1 CQFP G4T CQFP G2U/G2L CQFP G1U/G1T CS1-4 capacitance Data I/O capacitance Address input capacitance Symbol C OE CWE Conditions VIN = 0V, f = 1.0 MHz VIN = 0V, f = 1.0 MHz 20 50 20 20 CC S CI/O CA D VIN = 0V, f = 1.0 MHz VI/O = 0V, f = 1.0 MHz VIN = 0V, f = 1.0 MHz 20 20 50 pF pF pF Max 50 Unit pF pF
This parameter is guaranteed by design but not tested.
DC CHARACTERISTICS (VCC = 5.0V, GND = 0V, TA = -55°C TO +125°C)
Parameter Input Leakage Current Output Leakage Current Operating Supply Current Standby Current Output Low Voltage Output High Voltage Parameter Input Leakage Current Output Leakage Current Operating Supply Current Standby Current Output Low Voltage Sym ILI I LO IC C IS B VOL VOH Sym ILI I LO ICC IS B VOL Conditions Min VCC = 5.5, VIN = GND to VCC CS = VIH, OE = VIH, VOUT = GND to VCC CS = VIL, OE = VIH, f = 5MHz, Vcc = 5.5 CS = VIH, OE = VIH, f = 5MHz, Vcc = 5.5 IOL = 8mA, VCC = 4.5 IOH = -4.0mA, VCC = 4.5 Conditions Min VCC = 5.5, VIN = GND to VCC CS = VIH, OE = VIH, VOUT = GND to VCC CS = VIL, OE = VIH, f = 5MHz, Vcc = 5.5 CS = VIH, OE = VIH, f = 5MHz, Vcc = 5.5 IOL = 2.1mA, VCC = 4.5 2.4 2.4 -15 Max 10 10 600 80 0.4 2.4 -35 Max 10 10 600 60 0.4 2.4 Min -17 Min Max 10 10 600 80 0.4 2.4 -45 Max 10 10 600 60 0.4 2.4 Min -20 Min Max 10 10 600 80 0.4 2.4 -55 Max 10 10 600 60 0.4 Min -25 Max 10 10 600 60 0.4 Units µA µA mA mA V V Units µA µA mA mA V V
IOH = -1.0mA, VCC = 4.5 Output High Voltage VOH NOTE: DC test conditions: VIH = VCC -0.3V, VIL = 0.3V
DATA RETENTION CHARACTERISTICS (FOR WS128K32L-XXX ONLY) (TA = -55°C TO +125°C), (TA = -40°C TO +85°C)
Characteristic Data Retention Voltage Data Retention Quiescent Current Chip Disable to Data Retention Time (1) Operation Recovery Time (1) Sym VC C ICCDR TCDR TR Conditions VCC = 2.0V C S VCC -0.2V VIN VCC -0.2V or VIN - 0.2V Min 2 0 T RC Typ 1 Max 2 Units V mA ns ns
NOTE: Parameter guaranteed, but not tested.
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White Electronic Designs Corporation · (602) 437-1520 · www.whiteedc.com
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