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Details, datasheet, quote on part number:WS128K32V
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| Part: | WS128K32V |
| Category: | Memory => SRAM => MCPSRAM |
| Description: | Organization = 128Kx32 ;; Speed (ns) = 15-35 ;; Volt = 3.3 ;; Package = 68 CQFP ;; Temp = C,i,m ;; |
| Company: | White Electronic Designs Corporation |
| Datasheet: | Download WS128K32V datasheet File size : 338 kB |
| Request For quote: | Find where to buy WS128K32V
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Datasheet text preview:
White Electronic Designs
128Kx32 3.3V SRAM MODULE
F E ATURES
n Access Times of 15**, 17, 20, 25, 35ns n MIL-STD-883 Compliant Devices Available n Low Voltage Operation n Packaging 66-pin, PGA Type, 1.075 inch square Hermetic Ceramic HIP (Package 400) 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square (Package 510), 3.56mm (0.140 inch) high. 68 lead, Hermetic CQFP (G1U) , 23.9mm (0.940 inch) square (Package 519), 3.56mm (0.140 inch) high.
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WS128K32V-XXX
PRELIMINARY* n n n n n n n Organized as 128Kx32; User Configurable as 256Kx16 or 512Kx8 Commercial, Industrial and Military Temperature Ranges 3.3 Volt Power Supply Low Power CMOS TTL Compatible Inputs and Outputs Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation Weight WS128K32V-XG2UX - 8 grams typical WS128K32NV-XH1X - 13 grams typical WS128K32V-XG1UX1 - 5 grams typical WS128K32V-XG1TX - 5 grams typical
68 lead, Hermetic CQFP (G1T), 23.9mm (0.940 inch) square (Package 524), 4.06mm (0.160 inch) high.
*This data sheet describes a product under development, not fully characterized, and is subject to change without notice. **Commercial and Industrial only. Note 1: Package Not Recommended For New Design
FIG. 1
PIN CONFIGURATION FOR WS128K32NV-XH1X TOP VIEW PIN DESCRIPTION
I/O0-31 Data Inputs/Outputs A0-16 WE1-4 CS1-4 OE VCC GND NC Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Not Connected
BLOCK DIAGRAM
April 2003 Rev. 4
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
TOP VIEW
WS128K32V-XXX
FIG. 2 PIN CONFIGURATION FOR WS128K32V-XG1TX, WS128K32V-XG2UX AND WS128K32V-XG1UX1 PIN DESCRIPTION
I/O0-31 Data Inputs/Outputs A0-16 WE1-4 CS 1-4 OE VCC GND NC Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Not Connected
BLOCK DIAGRAM
Note 1: Package Not Recommended For New Design
White Electronic Designs Corporation Phoenix AZ (602) 437-1520
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White Electronic Designs
ABSOLUTE MAXIMUM RATINGS
Parameter Operating Temperature Storage Temperature Signal Voltage Relative to GND Junction Temperature Supply Voltage Symbol TA TSTG VG TJ VCC -0.5 Min -55 -65 -0.5 Max +125 +150 4.6 150 5.5 Unit °C °C V °C V CS H L L L OE X L X H WE X H L H
WS128K32V-XXX
TRUTH TABLE
Mode Standby Read Write O u t Disable Data I/O High Z D a t a Out D a t a In High Z Power Standby Active Active Active
RECOMMENDED OPERATING CONDITIONS
Parameter Supply Voltage Input High Voltage Input Low Voltage Symbol VCC VIH VIL Min 3.0 2.2 -0.3 Max 3.6 V C C + 0.3 +0.8 Unit V V V Parameter OE capacitance WE1-4 capacitance HIP (PGA) CQFP G2U/G1U/G1T CS1-4 capacitance Data I/O capacitance Address input capacitance
CAPACITANCE (TA = +25°C)
Symbol COE CWE Conditions VIN = 0 V, f = 1.0 MHz VIN = 0 V, f = 1.0 MHz Max 50 20 20 20 20 50 Unit pF pF
CCS CI/O CAD
VIN = 0 V, f = 1.0 MHz VI/O = 0 V, f = 1.0 MHz VIN = 0 V, f = 1.0 MHz
pF pF pF
This parameter is guaranteed by design but not tested.
DC CHARACTERISTICS (VCC = 3.3V ±0.3V, VSS = 0V, TA = -55°C TO +125°C)
Parameter Input Leakage Current Output Leakage Current Operating Supply Current (x 32 Mode) Standby Current Output Low Voltage Output High Voltage Sym I LI I LO I CC x 32 I SB VOL VOH Conditions VIN = GND to VCC CS = VIH, OE = VIH, VOUT = GND to VCC CS = VIL, OE = VIH, f = 5MHz CS = VIH, OE = VIH, f = 5MHz I OL = 8mA I OH = -4.0mA 2.4 Min Max 10 10 500 32 0.4 Units µA µA mA mA V V
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
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