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Details, datasheet, quote on part number:X80010
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| Part: | X80010 |
| Category: | Power Management => Power Distribution/Switches => Hot-Swap Controllers => Hotswap & Power Sequencers |
| Description: | Hot Swap And Power Sequence Controller |
| Company: | Xicor, Inc. |
| Datasheet: | Download X80010 datasheet File size : 358 kB |
| Request For quote: | Find where to buy X80010
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Datasheet text preview:
New Industry Features
Flexible Power Sequencing modes Battery backup mode Hardshor t retry Five power good signals
X80010/11/12/13
Penta-Power Sequence Controller
with Hot swap and System Management
APPLICATIONS · -48V Hot Swap Power Backplane/Distribution Central Office, Ethernet for VOIP · Card Insertion Detection · Power Sequencing DC-DC/Power Bricks · IP Phone Applications · Databus Power Interfacing · Custom Industrial Power Backplanes · Distributed Power Systems DESCRIPTION The X80010/11/12/13 contains three major functions: a power sequencing controller, a hotswap controller, and systems management support. The power sequencer controller time sequences up to five DCDC modules. The device allows various DC/DC power sequencing configurations, either parallel or relay modes. The power good, enable, and voltage good signals provide for flexible DC-DC timing configurations. Each voltage enable signal has a built-in delay while additional delay can be added with simple external passive components. The hot swap controller allows a board to be safely inserted and removed from a live backplane without turning off the main power supply. The X80000 family of devices offers a modular, power distribution approach by providig flexibility to solve the hotswap and power sequencing issues for insertion, operations, and extraction. Hardshort Detection and Retry with Delay, Noise filtering, Insertion Overcurrent Bypass, and Gate Current selection are some of the integrated features of the device. During insertion, the gate of an external power MOSFET is
FEATURES · Integrates Three Major Functions -- Power Sequencing -- Hot Swap Controller -- System Management Functions · Penta-Power Sequencing -- Sequence up to 5 DC/DC converters. -- Four independent voltage enable pins -- Four time delay circuits -- Soft Power Sequencing - MRC pin restarts sequence without power cycling. · Hot Swap Controller -- Programmable overvoltage and undervoltage protection -- Undervoltage lockout for battery/redundant supplies -- Electronic circuit breaker - Overcurrent Detection and Gate Shut-off -- Overcurrent limit during Insertion -- Hardshor t retry with retry failure flag -- Selectable gate current using IGQ pins (10, 70, 150uA) -- MRH pin controls board insertion/extraction. -- Typically operates from -30V to -80V. Tolerates transients to -200V (limited by external components) · System Management -- Reset output, with delay, holds off host until all supplies are good -- Host control of reinsertion with MRH input -- Host control of resequencing using MRC input · Available packages -- 32-lead Quad No-Lead Frame (QFN)
TYPICAL APPLICATION
BackPlane DC-DC Module 1
ON/OFF
X80010/11/12/13
DC-DC Module 2
ON/OFF
DC-DC Module 3
ON/OFF
DC-DC Module 4
ON/OFF
-48V RTN R5 30k 1% R4 182k 1% VUV/OV OV=71V UV=37V VDD R6 10k 1%
PWRGD V1GOOD V2GOOD V3GOOD V1 V2 EN1 EN2 EN3 V3
VEE SENSE GATE DRAIN 12V -48V
0.02 5%
4.7V
Rs
0.1uF
100
100K
V4
Q1 IRFR120
REV 1.18 10/15/02
www.xicor.com
Characteristics subject to change without notice
1 of 23
X80010/11/12/13 Preliminary Information
DESCRIPTION (Continued) clamped low to suppress contact bounce. The under-voltage/ over-voltage circuits and the power on reset circuitry suppress the gate turn on until the mechanical bounce has ended. The X80000 turns on the gate with a user set slew rate to limit the inrush current and incorporates an electronic circuit breaker set by a sense resistor. After the load is successfully charged, the PWRGD signal is asserted; indicating that the device is ready to power sequence the DC-DC power bricks. ORDERING INFORMATION
QFN package (Top view)
MRH IGQ0 IGQ1 PWRGD BATT-ON FAR NC VEE
Systems management function provides a reset signal indicating that the power good and all the voltage good signals are active. The reset signal is asserted after a wait state delay. This signal is used to coordinate the hotswap and DC-DC module latencies during power up to avoid "power hang up". In addition, the CPU host can initiate soft insertion or DC voltage module re-sequencing.
VRGO NA V4GOOD EN4 V3GOOD EN3 V2GOOD EN2
1 2 3 4 5 6 7 8
32 31 30 29 28 27 26 25
(7mm x 7mm)
24 23 22 21 20 19 18 17
NC MRC NA RESET V1GOOD EN1 NA NA
9 10 11 12 13 14 15 16
SENSE GATE DRAIN NA NA
VUV/OV
VDD
VEE
ORDER NUMBER X80010Q32I X80011Q32I X80012Q32I X80013Q32I
OV (V) 74.9 68.0 74.9 68.0
UV1 (V) 42.4 42.4 42.4 42.4
UV2 (V) 33.2 33.2 33.2 33.2
tNF (us) 5 5 5 5
VOC (mV) 50 50 50 50
VOCI (mV) 150 150 150 150
Over Retry Current Delay IGATE TDELAY (ms) Retry (ms) (uA) Always 100 50 100 Always 100 50 100 5 retries 100 50 100 5 retries 100 50 100
tPOR (ms) 100 100 100 100
Temp -40oC to 85oC -40oC to 85oC -40oC to 85oC -40oC to 85oC
PART MARK 80010I 80011I 80012I 80013I
ABSOLUTE MAXIMUM RATINGS Temperature under bias ..... 65°C to +135°C Storage temperature .......... 65°C to +150°C Voltage on given pin (Hot Side Functions): Vov / uv pin ...5.5V + VEE SENSE pin ....... 400mV + VEE VEE pin.........-80V DRAIN pin .... 48V + VEE PWRGD pin ... 7V + VEE GATE pin..... VDD + VEE FAR pin .......... 7V + VEE MRH pin ...... 5.5V + VEE BATT_ON pin ....... 5.5V + VEE Voltage on given pin (Cold Side Functions): ENi pins (i = 1 to 4)... 5V ViGOOD pins (i = 1 to 4) ....5.5V + VEE RESET pin .. 5.5V + VEE MRC pin ...... 5.5V + VEE IGQ1 and IGQ0 pins ........... 5.5V + VEE VDD pin ........ 14V + VEE D.C. output current ......... 5mA Lead temperature (soldering, 10 seconds) ........ 300°C
REV 1.18 10/15/02
COMMENT Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only; functional operation of the device (at these or any other conditions above those listed in the operational sections of this specification) is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS Temperature Industrial Min. 40°C Max. +85°C
Supply Voltage VDD = 12V
www.xicor.com
Characteristics subject to change without notice
2 of 23
X80010/11/12/13 Preliminary Information
ELECTRICAL CHARACTERISTICS (Standard Settings) (Over the recommended operating conditions unless otherwise specified). Symbol Parameter Min. 10 4.5 46.2 52.5 Typ. 12 2.5 Max. 14 5 5.5 50 58.8 Unit V mA IRGO=10uA Gate Drive On, VGATE = VEE, VSENSE = VEE (sourcing) mA VGATE - VEE = 3V VSENSE-VEE = 0.1V (sinking) V IGATE = 50uA V V V µA µA Referenced to VEE VUV1 < VUV/OV < VOV µA µA Test Conditions
DC Characteristics VDD Supply Operating Range IDD Supply Current Regulated 5V output VRGO IRGO VRGO current output IGATE Gate Pin Current
9 VGATE VPGA VIHB VILB ILI ILO External Gate Drive (Slew Rate Control) Power Good Threshold (PWRGD High to Low) Voltage Input High (BATT_ON) Voltage Input Low (BATT_ON) Input Leakage Current (MRH, MRC) Output Leakage Current (V1GOOD, V2GOOD, V3GOOD, V4GOOD, RESET) Input LOW Voltage (MRH, MRC, IGQ0, IGQ1) Input HIGH Voltage (MRH, MRC, IGQ0, IGQ1) Output LOW Voltage (RESET, RESET, V1GOOD, V2GOOD, V3GOOD, V4GOOD, FAR, PWRGD) Output Capacitance (RESET, V1GOOD, V2GOOD, V3GOOD, V4GOOD, FAR) Input Capacitance (MRH, MRC) Over-current threshold Over-current threshold (Insertion) VDD-1 0.9 VEE + 4 1 VDD 1.1 VEE + 5 VEE + 2 10 10
VIL = GND to VCC All ENi = VRGO for i = 1 to 4
VIL(3) VIH(3) VOL
-0.5 + VEE (VEE + 5) x 0.7
(VEE + 5) x 0.3 (VEE + 5) + 0.5 VEE + 0.4
V V V IOL = 4.0 mA (VEE + 2.7 to VEE + 5.5V) IOL = 2.0 mA (VEE + 2.7 to VEE + 3.6V) VOUT = 0V
COUT(1)
8
pF
CIN(1) VOC VOCI
45 135
50 150
6 55 165
pF VIN = 0V mV VOC = VSENSE - VEE mV VOC = VSENSE - VEE PWRGD = HIGH Initial Power Up condition V Referenced to VEE
VOVR
Overvoltage threshold (rising) X80010, X80012 X80011, X80013 Overvoltage threshold (falling) X80010, X80012 X80011, X80013 Undervoltage 1 threshold (rising) Undervoltage 1 threshold (falling) Undervoltage 2 threshold (rising) Undervoltage 2 threshold (falling)
3.85 3.49 3.82 3.46 2.19 2.16 1.71 1.68
3.90 3.54 3.87 3.51 2.24 2.21 1.76 1.73
3.95 3.59 3.92 3.56 2.29 2.26 1.81 1.78
VOVF
V V V V V
Referenced to VEE Referenced to VEE BATT-ON = VEE Referenced to VEE BATT-ON = VRGO
VUV1R VUV1F VUV2R VUV2F
REV 1.18 10/15/02
www.xicor.com
Characteristics subject to change without notice
3 of 23
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