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Details, datasheet, quote on part number:XQ4010E-4CB
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Datasheet text preview:
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QPRO XQ4000E/EX QML High-Reliability FPGAs
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DS021 (v2.2) June 25, 2000
Product Specification
Product Features
· · Cer tified to MIL-PRF-38535, appendix A QML (Qualified Manufacturers Listing) Also available under the following Standard Microcircuit Drawings (SMD) X C400 5E 5962-975 22 X C401 0E 5962-975 23 X C401 3E 5962-975 24 X C402 5E 5962-975 25 XC4028EX 5962-985 09 For more information contact the Defense Supply Center Columbus (DSCC) http://www.dscc.dla.mis/v/va/smd/smdsrch.html System featured Field-Programmable Gate Arrays - Select-RAMTM memory: on-chip ultra-fast RAM with · Synchronous write option · Dual-por t RAM option - Abundant flip-flops - Flexible function generators - Dedicated high-speed carry logic - Wide edge decoders on each edge - Hierarchy of interconnect lines - Inter nal 3-state bus capability - Eight global low-skew clock or signal distribution networks System Performance beyond 60 MHz Flexible Array Architecture Low Power Segmented Routing Architecture Systems-Oriented Features - IEEE 1149.1-compatible boundary scan logic support - Individually programmable output slew rate - Programmable input pull-up or pull-down resistors - 12 mA sink current per XQ4000E/EX output · · Configured by Loading Binary File - Unlimited reprogrammability Readback Capability - Program verification - Inter nal node observability Backward Compatible with XC4000 Devices Development System runs on most common computer platforms - Interfaces to popular design environments - Fully automatic mapping, placement and routing - Interactive design editor for design optimization Available Speed Grades: - X Q4 000E -3 for plastic packages only -4 for ceramic packages only - XQ4028EX -4 for all packages
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More Information
For more information refer to Xilinx XC4000E and XC4000X ser ies Field Programmable Gate Arrays product specification. This data sheet contains pinout tables for XQ4010E only. Refer to Xilinx web site for pinout tables for other devices. (Pinouts for XQ4000E/EX are identical to XC4000E/EX.) (http://www.xilinx.com/partinfo/databook.htm)
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© 2000 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS021 (v2.2) June 25, 2000 Product Specification
www.xilinx.com 1-800-255-7778
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QPRO XQ4000E/EX QML High-Reliability FPGAs
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Table 1: XQ4000E/EX Field Programmable Gate Arrays M ax. Max. Logic RAM Bits Gates (No (No RAM) Logic) 5,000 10, 000 6, 272 12,800 Typical Gate Range (Logic and RAM)(1) 3,000 - 9,000 7,000 - 20,000 Number of Flip-Flops 616 1,120 Max. Decode Inputs per Side 42 60 Max. User I/O 11 2 16 0
Device X Q4 0 0 5 E X Q4 0 1 0 E
CLB Matrix 14 x 14 20 x 20
Total CL Bs 196 400
Packages P G156 , CB164 P G1 9 1 , CB196, HQ208 P G2 2 3 , CB228, HQ240 P G299 , CB228 P G299 , CB228, HQ240, BG352
X Q4 0 1 3 E
13, 000
18,432
10,000 - 30,000 24 x 24
576
1,536
72
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X Q4 0 2 5 E X Q 4028E X
25, 000 28, 000
32,768 32,768
15,000 - 45,000 32 x 32 18,000 - 50,000 32 x 32
1,024 1,024
2,560 2,560
96 96
25 6 25 6
Notes: 1. Max values of Typical Gate Range include 20-30% of CLBs used as RAM.
XQ4000E Switching Characteristics
XQ4000E Absolute Maximum Ratings(1)
Sym bol V CC VIN VTS TSTG TSOL TJ Supply voltage relative to GND Input voltage relative to GND(2) Voltage applied to High-Z output(2) Description 0.5 to +7.0 0.5 to VCC + 0.5 0.5 to VCC + 0.5 65 to +150 +2 6 0 +15 0 +12 5 Units V V V °C °C °C °C
Storage temperature (ambient) Maximum soldering temperature (10s @ 1/16 in. = 1.5 mm) Junction temperature Ceramic package Plastic package
Notes: 1. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability. 2. Maximum DC excursion above V CC or below Ground must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During transitions, the device pins may undershoot to 2.0V or overshoot to VCC + 2.0V, provided this over or undershoot lasts less than 10 ns and with the forcing current being limited to 200 mA.
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www.xilinx.com 1-800-255-7778
DS021 (v2.2) June 25, 2000 Product Specification
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QPRO XQ4000E/EX QML High-Reliability FPGAs
XQ4000E Recommended Operating Conditions(1,2)
Symbol V CC VIH VIL TIN Description Supply voltage relative to GND, TJ = 55°C to +125°C Supply voltage relative to GND, TC = 55°C to +125°C High-Level Input Voltage Plastic Ceramic TTL inputs CMOS inputs Low-Level Input Voltage TTL inputs CMOS inputs Input signal transition time Min 4. 5 4. 5 2. 0 70 % 0 0 M ax 5.5 5.5 V CC 10 0% 0.8 20% 250 Units V V V VCC V VCC ns
Notes: 1. At junction temperatures above those listed as Operating Conditions, all delay parameters increase by 0.35% per °C. 2. Input and output measurement threshold are 1.5V for TTL and 2.5V for CMOS.
XQ4000E DC Characteristics Over Recommended Operating Conditions
Symbol VOH VOL I CCO IL CIN IRIN IRLL Description High-level output voltage @ IOH = 4.0 mA, VCC min High-level output voltage @ IOH = 1.0 mA, VCC min Low-level output voltage @ IOL = 12.0 mA, VCC min(1) Quiescent FPGA supply current(2) TTL outputs CMOS outputs TTL outputs CMOS outputs Min 2. 4 VCC 0.5 10 tested)(3) Low(3) 0. 02 0. 2 M ax 0.4 0.4 50 +1 0 16 0.25 2.5 Units V V V V mA µA pF mA mA
Input or output leakage current Input capacitance (sample tested) Pad pull-up (when selected) at VIN = 0V (sample
Horizontal longline pull-up (when selected) at logic
Notes: 1. With 50% of the outputs simultaneously sinking 12 mA, up to a maximum of 64 pins. 2. With no output current loads, no active input or Longline pull-up resistors, all package pins at VCC or GND, and the FPGA configured with the development system Tie option. 3. Characterized Only.
DS021 (v2.2) June 25, 2000 Product Specification
www.xilinx.com 1-800-255-7778
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