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Details, datasheet, quote on part number:ZMD31050
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Datasheet text preview:
ZMD31050 RBICseries
Advanced Differential Sensor Signal Conditioner
Datasheet Features
· · · · · · · · · · · · Digital compensation of sensor offset, sensitivity, temperature drift and non-linearity Accommodates nearly all bridge sensors by PGA and programmable ADC Capable with sensor signals from 1 up to 275mV/V span Sensor connections check and aging detection Selectable temperature compensation reference: bridge, thermistor, internal diode or external diode Output options: voltage (0...5V), current (4...20mA), PWM, I2C, SPI, ZACwireTM (one-wireinterface), alarm Adjustable output resolution (up to 15 bits) versus sampling rate (up to 3.9kHz) Selectable bridge excitation: ratiometric voltage, constant voltage or constant current Input channel for separate temperature sensor Operation temperature -40...+125°C (-50...+150°C derated) Supply voltage +2.7V...+5.5V Available in SSOP16 or as die
PRELIMINARY Brief Description
The ZMD31050 is a CMOS integrated circuit that belongs to ZMD's RBICseries. It performs highlyaccurate amplification/scaling and sensor-specific correction of bridge sensor signals. Digital compensation of sensor offset, sensitivity, temperature drift and non-linearity is accomplished via a 16-bit RISC micro-controller running a correction algorithm with calibration coefficients stored in nonvolatile EEPROM. The ZMD31050 accommodates virtually any bridge sensor (e.g. piezo-resistive, ceramic-thickfilm or steel membrane based). In addition, the IC can interface a separate temperature sensor. The bi-directional digital interfaces (I2C, SPI, ZACwireTM) can be used for a simple PC-controlled calibration, in order to program a set of calibration coefficients into an on-chip EEPROM. Thus a specific sensor and a ZMD31050 are mated digitally: fast, precise and without the cost overhead associated with laser trimming, or mechanical potentiometer methods. Application kit available (SSOP16 samples, calibration PCB, calibration software, technical documentation) Support for industrial mass calibration available Quick circuit customization possible for large production volumes
Benefits
· · · No external trimming components required PC-controlled configuration and calibration via digital bus interface - simple, low cost High accuracy (±0.1% FSO @ -25...85°C; ±0.25% FSO @ -40...125°C)
Application Circuit (Examples)
Fig.1: Ratiometric measurement with voltage output, temperature compensation via external diode
Fig.2: Two wire 4...20mA (5...40V) configuration. Temperature compensation via internal diode
Copyright © 2003, ZMD AG, Rev. 0.6.2, 2003-11-18, PRELIMINARY 1/23 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31050 RBICseries
Advanced Differential Sensor Signal Conditioner
Datasheet PRELIMINARY
Contents
1. CIRCUIT DESCRIPTION ..... 3 1.1 SIGNAL FLOW ............ 3 1.2 APPLICATION MODES..........4 1.3 ANALOG FRONT END (AFE) ......... 5 1.3.1. Programmable Gain Amplifier ............ 5 1.3.2. Measurement Cycle Realized by Multiplexer .... 5 1.3.3. Analog Offset Compensation .... 6 1.3.4. Analog-to-Digital Converter ....... 6 1.4 SYSTEM CONTROL.....8 1.5 OUTPUT STAGE ......... 9 1.5.1. Serial Digital Interface ............. 10 1.5.2. ZACwireTM Single Wire Digital Interface .......... 10 1.5.3. Analog Output .......... 12 1.5.4. Comparator Module (ALARM Output) ....... 13 1.6 VOLTAGE REGULATOR ...... 13 1.7 ERROR DETECTION .......... 14 2. 3. 4. 5. APPLICATION CIRCUIT EXAMPLES.......15 ESD/LATCH-UP-PROTECTION.......15 PIN CONFIGURATION AND PACKAGE .. 16 IC CHARACTERISTICS .... 17 5.1 ABSOLUTE MAXIMUM RATINGS.........17 5.2 OPERATING CONDITIONS (VOLTAGES RELATED TO VSS) ........ 17 5.3 BUILD IN CHARACTERISTICS.............18 5.3.8 Cycle Rate versus A/D-Resolution ....... 19 5.3.9 PWM Frequency...........19 5.4 ELECTRICAL PARAMETERS (VOLTAGES RELATED TO VSS)......20 5.5 INTERFACE CHARACTERISTICS ......... 21 6. 7. 8. 9. 10. TEST .......... 22 RELIABILITY ............ 22 CUSTOMIZATION .... 22 RELATED DOCUMENTS .. 22 ORDERING INFORMATION.............23
Copyright © 2003, ZMD AG, Rev. 0.6.2, 2003-11-18, PRELIMINARY 2/23 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31050 RBICseries
Advanced Differential Sensor Signal Conditioner
Datasheet PRELIMINARY
1.
1.1
Circuit Description
Signal Flow
Fig.3: Block diagram of ZMD31050
PGA MUX ADC CMC DAC FIO1 FIO2 SIF PCOMP EEPROM TS ROM PWM programmable gain amplifier multiplexer analog-to-digital converter calibration microcontroller digital-to-analog converter flexible I/O 1: analog out (voltage/current), PWM2, ZACwireTM (one-wire-interface) flexible I/O 2: PWM1, SPI data out, SPI slave select, Alarm1, Alarm2 serial interface: I2C data I/O, SPI data in, clock programmable comparator for calibration parameters and configuration on-chip temperature sensor (pn-junction) for correction formula and algorithm PWM module
The ZMD31050's signal path is partly analog (blue) and partly digital (red). The differential signal from the bridge sensor is pre-amplified by the programmable gain amplifier (PGA). The Multiplexer (MUX) transmits the signals from bridge sensor, external diode or separate temperature sensor to the ADC in a certain sequence (instead of the temp. diode the internal pnjunction (TS) can be used optionally). Afterwards the ADC converts these signals into digital values. The digital signal correction takes place in the calibration micro-controller (CMC). It is based on a special correction formula located in the ROM and on sensor-specific coefficients (stored into the EEPROM during calibration).
Copyright © 2003, ZMD AG, Rev. 0.6.2, 2003-11-18, PRELIMINARY 3/23 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
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