Micro Xinger 3dB Hybrid Coupler
Description
The 1M803 Micro Xinger® is a low profile, miniature 3dB hybrid coupler in an easy to use surface mount package designed for U-NII, ISM and hyperLAN applications. The 1M803 is designed for balanced amplifiers and signal distribution and is an ideal solution for the ever increasing demands of the wireless industry for smaller printed circuit boards and high performance. Parts have been subjected to rigorous qualification testing and units are 100% tested. They are manufactured using materials with x and y thermal expansion coefficients compatible with common substrates such as FR4 and G-10.
ELECTRICAL SPECIFICATIONS** Features:
· 5.0 6.0 GHz · Very Low Loss · High Isolation · 90o Quadrature · · · · Surface Mountable Tape And Reel New Micro-Package 100% Tested Frequency
GHz
Isolation
dB Min
Insertion Loss
dB Max
VSWR
Max:1
5.0 6.0 Amplitude Balance
dB Max
20 Phase Balance
Degrees
0.25 Power
Ave. CW Watts
1.21 JC
ºC/Watt
Operating Temp.
ºC
± 0.30
±3
20
78.1
-55 to +85
**Specification based on performance of unit properly installed on microstrip printed circuit boards with 50 nominal impedance. Specifications subject to change without notice.
Outline Drawing
Top View (Near-side) Side View .065±.007 [1.66±0.18] Pin 2 GND .200±.010 [5.08±0.25] .104±.004 [2.64±0.10] Denotes Array Number .304±.004 [7.72±0.10] 4X .048±.008 SQ [1.22±0.20] Bottom View (Far-side)
