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Details, datasheet, quote on part number:XB625
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| Part: | XB625 |
| Category: | RF & Microwaves |
| Description: | Description = Mini Xinger Balun Transformers ;; Size LXWXH = 0.30" X 0.25" X 0.067" ;; Packaging = Surface Mount ;; Frequency MHZ = 2400-2500 ;; Power Handling Watts = 22 |
| Company: | Anaren Microwave |
| Datasheet: | Download XB625 datasheet File size : 417 kB |
| Request For quote: | Find where to buy XB625
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Datasheet text preview:
Model XB625
Rev A
Mini Balun 50 to 25 Balanced
Description
The XB625 is a low profile mini balanced to unbalanced transformer designed for differential inputs and output locations on next generation wireless chipsets in an easy to use surface mount package covering 802.11b and 802.11g. The XB625 is ideal for high volume manufacturing and is higher performance than traditional ceramic baluns. The XB625 has an unbalanced port impedance of 50 and a 25 balanced port impedance*. This transformation enables single ended signals to be applied to differential ports on modern integrated chipsets. The output ports have equal amplitude (-3dB) with 180 degree phase differential. The XB625 is available on tape and reel for pick and place high volume manufacturing. * 25 Referenced to Ground
ELECTRICAL SPECIFICATIONS**
· · · · · · · · · ·
Features:
2.4 2.6 GHz 180° Transformer 50 Ohm to 2 x 25 Ohm Low Insertion Loss Medium Power Even Order Harmonic Suppression Input to Output DC Isolation Surface Mountable Tape & Reel Convenient Package
Frequency
GHz
Unbalanced Port Impedance
Ohms
Balanced Port Impedance*
Ohms
Return Loss
dB min
Insertion Loss
dB max
2.4 2.6 Amplitude Balance
dB max
50 Phase Balance
Degrees max
25 Power Handling
Watts
20.0 JC
șC / Watt
0.4 Operating Temp.
șC
0.5
180+ 5.0
22
18.7
-55 to +85
**Specification based on performance of unit properly installed on microstrip printed circuit boards with 50 nominal impedance. Specifications subject to change without notice. * 50 reference to ground
Outline Drawing
Top View (Near-side) .300±.010 [7.62±0.25] Pin 2 .069±.009 [1.76±0.23] Pin 3 Side View Bottom View (Far-side) .091±.004 [2.32±0.10] Pin 3 2 Places .082±.004 x .033±.004 [2.09±0.10 x 0.83±0.10] Pin 2
.250±.010 [6.35±0.25]
.039±.004 [0.98±0.10]
Pin 1
Orientation Marker
Dimensions are in Inches [Millimeters] XB625 Rev A Mechanical Outline
Pin 1 .070±.004 x .027±.004 [1.79±0.10 x 0.68±0.10]
.033±.004 [0.83±0.10] .185±.004 [4.70±0.10]
Available on Tape and Reel For Pick and Place Manufacturing.
USA/Canada: Toll Free: Europe:
(315) 432-8909 (800) 544-2414 +44 2392-232392
Model XB625
Rev A
Typical Performance: 2.2 GHz. to 2.8 GHz.
Return Loss XB625
0 -5
0. 5 0. 4 0. 3
Amplitude Balance XB625
Am plitude Balance [dB]
2300 2400 2500 2600 2700 2800
-10
Return Loss [dB]
0. 2 0. 1 0 -0. 1 -0. 2 -0. 3
-15 -20 -25 -30 -35 -40 2200
-0. 4 -0. 5 2200
2300
2400
2500
2600
2700
2800
Frequency [MHz]
Frequenc y [MHz]
Insertion Loss XB625
0 -0. 05 -0.1 -170 -172 -174
Phase Balance XB625
Ins ertion Loss [dB]
-0. 15 -0.2 -0. 25 -0.3 -0. 35 -0.4 -0. 45 -0.5 2200
Phas e Balance [Degrees]
2300 2400 2500 2600 2700 2800
-176 -178 -180 -182 -184 -186 -188 -190 2200
2300
2400
2500
2600
2700
2800
Frequenc y [MHz]
Frequency [MHz]
Pin Configuration:
The internal configuration of the Xinger balun is diagramed to the left; the unbalanced port is DC connected to ground and the two balanced ports are DC connected and floating. For many chipset applications there is an opportunity to eliminate two decoupling capacitors and/or use a single bias point if applicable. Differential drive is popular in integrated circuit since it aids stability in the presence of bond wire and pin inductance, provides some degree of immunity to power supply and ground noise, and can provide higher output power in the case of some device limits. The construction of the Xinger balun is bonded multi-layered stripline made of low loss dielectric material with plated through vias connecting the internal circuitry to the external printed circuit board, similar to that of the Xinger hybrids and directional couplers.
USA/Canada: Toll Free: Europe:
(315) 432-8909 (800) 544-2414 +44 2392-232392
Available on Tape and Reel For Pick and Place Manufacturing.
Model XB625
Rev A
Typical Performance: 2.0 GHz. to 3.0 GHz.
Mounting Configuration:
To insure proper electrical and thermal performance there must be a ground plane under the part
In order for Xinger surface mount components to work optimally, there must be a 50 transmission line to the balanced port and 50 transmission lines from the unbalanced ports. If this condition is not satisfied, amplitude balance, insertion loss and VSWR may not meet published specifications. All of the Xinger components are constructed from ceramic filled PTFE composites which possess excellent electrical and mechanical stability having X and Y thermal coefficient o of expansion (CTE) of 17 ppm/ C An example of the PCB footprint used in the testing of these parts is shown to the left. In specific designs, the transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances.
Multiple plated thru holes to ground plane .200 [5.08] 25 Transmission Line 25 Transmission Line
.219 [5.55]
.034 TYP [0.86]
.100 [2.54] 50
2 Places .082±.004 x .043±.004 [2.08±0.10 x 1.09±0.10]
.070±.004 x .037±.004 Transmission Line [1.79±0.10 x 0.93±0.10] Dimensions are in Inches [Millimeters] XB625 Rev A Mounting Footprint
Available on Tape and Reel For Pick and Place Manufacturing.
USA/Canada: Toll Free: Europe:
(315) 432-8909 (800) 544-2414 +44 2392-232392
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