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Part: 2SJ530S

Category:
 Discrete
   -> Transistors
     -> FETs (Field Effect Transistors)
       -> MOSFETs
         -> N/P-Channel Combo

Description: Silicon P-channel MOSFET High Speed Power Switching

Company: Hitachi Semiconductor (acquired by Renesas)

Datasheet: Download 2SJ530S datasheet     File size : 137 kB

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Datasheet text preview:
2SJ530(L),2SJ530(S)
Silicon P Channel MOS FET High Speed Power Switching

ADE-208-655B (Z) 3rd. Edition Jun 1998 Features
· Low on-resistance R DS(on) = 0.08 typ. · 4V gate drive devices. · High speed switching.

Outline
DPAK­2

4 D

4

12 G

3

12 S

3

1. Gate 2. Drain 3. Source 4. Drain

2SJ530(L),2SJ530(S)
Absolute Maximum Ratings (Ta = 25°C)
Item Drain to source voltage Gate to source voltage Drain current Drain peak current Symbol VDSS VGSS ID I D(pulse)
Note1

Ratings ­60 ±20 ­15 ­60 ­15

Unit V V A A A A mJ W °C °C

Body-drain diode reverse drain current I DR Avalanche current Avalanche energy Channel dissipation Channel temperature Storage temperature Note: I AP
Note3 Note3 Note2

­15 19 30 150 ­55 to +150

EAR

Pch Tch

Tstg

1. PW 10µs, duty cycle 1 % 2. Value at Tc = 25°C 3. Value at Tch = 25°C, Rg 50

Electrical Characteristics (Ta = 25°C)
Item Drain to source breakdown voltage Gate to source breakdown voltage Zero gate voltege drain current Gate to source leak current Gate to source cutoff voltage Static drain to source on state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Body ­drain diode forward voltage Body ­drain diode reverse recovery time Note: 4. Pulse test Symbol V(BR)DSS V(BR)GSS I DSS I GSS VGS(off) RDS(on) RDS(on) |yfs| Ciss Coss Crss t d(on) tr t d(off) tf VDF t rr Min ­60 ±20 -- -- ­1.0 -- -- 6.5 -- -- -- -- -- -- -- -- -- Typ -- -- -- -- -- 0.08 0.11 11 850 420 110 12 75 125 75 ­1.1 70 Max -- -- ­10 ±10 ­2.0 0.10 0.16 -- -- -- -- -- -- -- -- -- -- Unit V V µA µA V S pF pF pF ns ns ns ns V ns I F = ­15A, VGS = 0 I F = ­15A, VGS = 0 diF/ dt =50A/µs Test Conditions I D = ­10mA, VGS = 0 I G = ±100µA, VDS = 0 VDS = ­60 V, VGS = 0 VGS = ±16V, VDS = 0 I D = ­1mA, VDS = ­10V I D = ­8A, VGS = ­10V Note4 I D = ­8A, VGS = ­4V Note4 I D = ­8A, VDS = ­10V Note4 VDS = ­10V VGS = 0 f = 1MHz VGS = ­10V, I D = ­8A RL = 3.75

2

2SJ530(L),2SJ530(S)
Main Characteristics

Power vs. Temperature Derating 40
Pch (W) I D (A)
­1000 ­300

Maximum Safe Operation Area

30

­100 ­30 ­10 ­3 ­1 ­0.3 ­0.1

10 µs
0 µs m Op ms s er ( at ion 1 sh o (T Operation in c= t) 25 this area is limited by R DS(on)
DC

Channel Dissipation

Drain Current

PW

10

20

=

10

1

10

Ta = 25 °C

0

50

100

150 Tc (°C)

200

Case Temperature

­0.1 ­0.3 ­1 ­3 ­10 ­30 ­100 Drain to Source Voltage V DS (V)

Typical Output Characteristics ­20 ­10 V ­6 V
I D (A)

Typical Transfer Characteristics ­20 V DS = ­10 V 1VMTF5FTU

­4 V
(A) ID Drain Current

­16

1VMTF5FTU ­3.5 V

­5 V

­16

­12
Drain Current

­12

­8

­3 V VGS = ­2.5 V

­8 Tc = 75 °C ­4 25 °C ­25 °C ­1 ­2 ­3 Gate to Source Voltage ­4 ­5 V GS (V)

­4

0

­2 ­4 ­6 Drain to Source Voltage

­8 ­10 V DS (V)

0

3

2SJ530(L),2SJ530(S)
Drain to Source Saturation Voltage vs. Gate to Source Voltage ­4.0
Drain to Source Saturation Voltage V DS(on) (V) Drain to Source On State Resistance R DS(on) ( )

Static Drain to Source on State Resistance vs. Drain Current 1 0.5 0.2 VGS = ­4 V 0.1 ­10 V

1VMTF5FTU

­3.2

­2.4

­1.6

­15 A ­10 A ­5 A

0.05

­0.8

0.02 0.01
­0.1 ­0.3 ­1 ­3

1VMTF5FTU
­10 ­30 ­100

0

­4

­8

­12

­16 V GS (V)

­20

Gate to Source Voltage

Drain Current

I D (A)

Static Drain to Source on State Resistance R DS(on) ( )

Forward Transfer Admittance |y fs | (S)

Static Drain to Source on State Resistance vs. Temperature 0.5 1VMTF5FTU 0.4 I D = ­15 A ­10 A 0.2 V GS = ­4 V ­15 A -5,­10A 0 ­40 ­10 V 0 40 80 Tc 120 (°C) 160 ­5 A

100 30 10 3 1 0.3

Forward Transfer Admittance vs. Drain Current

Ta = ­25 °C 25 °C 75 °C

0.3

0.1

0.1 ­0.1 ­0.3

V DS = ­10 V 1VMTF5FTU ­1 ­3 ­10 ­30 ­100

Case Temperature

Drain Current I D (A)

4

2SJ530(L),2SJ530(S)
Body­Drain Diode Reverse Recovery Time Typical Capacitance vs. Drain to Source Voltage VGS = 0 f = 1 MHz

500

5000

Reverse Recovery Time trr (ns)

Capacitance C (pF)

200 100 50

1000 300 100 30

Ciss

Crss

20 10 5 ­0.1 di / dt = 50 A / µs VGS = 0, Ta = 25 °C ­0.3 ­3 ­1 ­10 ­20 Reverse Drain Current I DR (A)

Coss

10 0 ­10 ­20 ­30 ­40 ­50 Drain to Source Voltage V DS (V)

Dynamic Input Characteristics

Switching Characteristics

V DS (V)

­20

­4

Switching Time t (ns)

V DD = ­10 V ­25 V ­50 V

V GS (V)

0

0 I D = ­15 A

1000 300 100 30 10 3 1 ­0.1 V GS = ­10 V, V DD = ­30 V Pw = 5 µs, duty < 1 % t d(off) tf tr t d(on)

Drain to Source Voltage

­40 V DS V DD = ­50 V ­25 V ­10 V V GS

­8

­60

­12

­80 ­100 0

­16 ­20 40

8

32 16 24 Gate Charge Qg (nc)

Gate to Source Voltage

­0.3

­1

­3

­10 ­20

Drain Current

I D (A)

5




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