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Part: 4AK23

Category:
 Discrete
   -> Transistors
     -> FETs (Field Effect Transistors)
       -> MOSFETs
         -> N-Channel

Description: Silicon N-channel Power MOSFET Array

Company: Hitachi Semiconductor (acquired by Renesas)

Datasheet: Download 4AK23 datasheet     File size : 67 kB

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Datasheet text preview:
4AK23
Silicon N-Channel Power MOS FET Array

Application
High speed power switching

Features
· Low on-resistance R DS(on) 0.25 , VGS = 10 V, I D = 2.5 A · Low drive current · High speed switching · High density mounting · Suitable for H-bridged motor driver

Outline

SP-12TA

1 G

2 D

5 G

4 D

8 G

9 D

12 G

11 D

12

3

4

5

6

7

8

9

10 1112

S3

S6

S7

S 10

1, 5, 8, 12. Gate 2, 4, 9, 11. Drain 3, 6, 7, 10. Source

4AK23
Absolute Maximum Ratings (Ta = 25°C)
Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body to drain diode reverse drain current Channel dissipation Channel dissipation Channel temperature Storage temperature Notes: 1. PW 10 µs, duty cycle 1% 2. 4 Devices operation Symbol VDSS VGSS ID I D(pulse)* I DR Pch (Tc = 25°C)* Pch* Tch Tstg
2 2 1

Ratings 100 ±20 5 20 5 32 4 150 ­55 to +150

Unit V V A A A W W °C °C

2

4AK23
Electrical Characteristics (Ta = 25°C)
Item Drain to source breakdown voltage Gate to source breakdown voltage Gate to source leak current Symbol V(BR)DSS V(BR)GSS I GSS Min 100 ±20 -- -- 1.0 -- -- Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Body to drain diode forward voltage Body to drain diode reverse recovery time Note: 1. Pulse Test |yfs| Ciss Coss Crss t d(on) tr t d(off) tf VDF t rr 3 -- -- -- -- -- -- -- -- -- Typ -- -- -- -- -- 0.2 0.25 5 525 205 60 5 30 180 65 1.0 170 Max -- -- ±10 250 2.0 0.25 0.35 -- -- -- -- -- -- -- -- -- -- Unit V V µA µA V S pF pF pF ns ns ns ns V µs I F = 5 A, VGS = 0 I F = 5 A, VGS = 0, dIF/dt = 50 A/µs Test conditions I D = 10 mA, VGS = 0 I G = ±100 µA, VDS = 0 VGS = ±16 V, VDS = 0 VDS = 80 V, VGS = 0 I D = 1 mA, VDS = 10 V I D = 2.5 A VGS = 10 V*1 I D = 2.5 A VGS = 4 V*1 I D = 2.5 A VDS = 10 V*1 VDS = 10 V VGS = 0 f = 1 MHz I D = 2.5 A VGS = 10 V RL = 12

Zero gate voltage drain current I DSS Gate to source cutoff voltage Static drain to source on state resistance VGS(off) RDS(on)

See characteristic curves of 2SK1300

3

4AK23
Maximum Channel Dissipation Curve 6 Channel Dissipation Pch (W) Channel Dissipation Pch (W) Condition : Channel Dissipation of each die is identical 4 Device Operation 3 Device Operation 2 Device Operation 1 Device Operation 48 Maximum Channel Dissipation Curve Condition : Channel Dissipation of each die is identical 4 Device Operation 3 Device Operation 2 Device Operation 1 Device Operation

4

32

2

16

0

50

100

150

0

50

100

150

Ambient Temperature Tc (°C)

Case Temperature Tc (°C)

Maximum Safe Operation Area 50 20 Drain Current I D (A) 10 5 2 1 0.5 0.2 0.1 0.05 0.1 0.2 0.5 1 2 5 10 20 50 100
n n) tio is (o ra rea DS pe a O his by R t in ited lim
10
µs

10

0 µs

PW = 10

1 m s

Drain to Source Voltage VDS (V)

DC O pe ra tio n

m s (1 Sh ot )

(T c = 25 °C )

4

Unit: mm

02 31.3 +0..3 ­ 24.4 ± 0.1 16.4 ± 0.3

5.0 ± 0.2 3.8 3.2 3.0 2.0 ± 0.1

3.2 10.0 ± 0.3 2.7 16.0 ± 0.3

2.54

1.4

0.85 ± 0.1

10.5 ± 0.5

2.2 ± 0.2

0.55

+0.1 ­0.06

1

2

3

4

5

6

7

8

9

10 11 12

Hitachi Code JEDEC EIAJ Weight (reference value)

SP-12TA -- -- 6.1 g




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