|Category||Electromechanical => Relays & I/O Modules => Radio Frequency (RF) Relays/High Frequency (HF) Relays|
|Title||Radio Frequency (RF) Relays/High Frequency (HF) Relays 5V 8GHZ TO-5 SMT High Repeat|
|Company||Teledyne (acquired by TelCom Semiconductor)|
|Datasheet||Download GRF312-5 datasheet
|Product Category||Radio Frequency (RF) Relays/High Frequency (HF) Relays|
|Contact Form||2 Form C (DPDT-BM)|
|Coil Voltage||5 VDC|
|SURFACE MOUNT HIGH REPEATABILITY 8 GHz TO-5 Relays SIGNAL INTEGRITY TO 12 Gbps DPDT
SERIES DESIGNATION GRF312 RELAY TYPE Repeatable, RF TO-5 relay PERFORMANCE FEATURES
The ultraminiature GRF312 relay is designed to improve upon the GRF300/GRF303 relay's high frequency performance. The GRF312 offers monotonic insertion loss to 8 GHz. This improvement in RF insertion loss over the frequency range makes these relays highly suitable for use in attenuator and other RF circuits. The GRF312 features: High repeatability. Broader bandwidth. Metal enclosure for EMI shielding.High isolation between control and signal paths. Highly resistant to ESD. CONSTRUCTION FEATURES
ENVIRONMENTAL AND PHYSICAL SPECIFICATIONS Temperature (Ambient) Vibration (General Note 1) Shock (General Note 1) Enclosure Weight Storage Operating +85°C 10 g's Hz 30 g's, 6ms half sine Hermetically sealed 0.09 oz. (2.55g) max.
The following unique construction features and manufacturing techniques provide excellent resistance to environmental extremes and overall high reliability. Uni-frame motor design provides high magnetic efficiency and mechanical rigidity. Minimum mass components and welded construction provide maximum resistance to shock and vibration. Advanced cleaning techniques provide maximum assurance of internal cleanliness. Gold-plated precious metal alloy contacts ensure reliable switching. Hermetically sealed. Solderable leads.62.3ps propagation delay time 51.3ps pulse rise time
1. Test conditions: a. Fixture:.031" copper clad, reinforced PTFE, RT/duroid® 6002 with SMA connectors. (RT/duroid® is a registered trademark of Rogers Corporation.) b. RF ground shield is soldered to PCB RF ground plane. c. Room ambient temperature. d. Terminals not tested were terminated with 50-ohm load. e. Contact signal level: 10 dBm. f. No. of test samples: 2. Data presented herein represents typical characteristics and is not intended for use as specification limits. Data is per pole, except fpr pole-to-pole data. Data is the average from readings taken on all open contacts. Data is the average from readings taken between poles with coil energized and de-energized. Data is the average from readings taken on all closed contacts. Test fixture effect de-embedded from frequency and time response data.
SERIES GRF312 GENERAL ELECTRICAL SPECIFICATIONS (@25°C unless otherwise noted) (Notes & 3) Contact Arrangement Rated Duty Contact Resistance Contact Load Rating Contact Life Ratings Coil Operating Power Operate Time Release Time Intercontact Capacitance Insulation Resistance Dielectric Strength 2 Form C (DPDT) Continuous 0.15 max. initial (measured 1/8" from the header) Resistive: 1Amp/28Vdc Low level: mV 10,000,000 cycles (typical) at low level 450 mW typical @ nominal rated voltage 4.0 mS max. 3.0 mS max. 0.4 pf typical 1,000 M min. between mutually isolated terminals 350 Vrms (60 Hz) @ atmospheric pressure
DETAILED ELECTRICAL SPECIFICATIONS (@25°C) BASE PART NUMBERS Coil Voltage, Nominal (Vdc) Coil Resistance (Ohms ±20%) Pick-up Voltage (Vdc max.)
1. Dimensions are in inches. Metric equivalents shown in parentheses. 2. Header dimensions, terminal numbering and schematic are as viewed from the terminals. 3. Positions 5 and 10 are for uninsulated case ground options. 4. To order the case ground option, after the series designator, add "Y" to the part number for position 5 or "Z" to the part number for position 10. Example: GRF312Y-5
Relays will exhibit no contact chatter in excess of 10 sec or transfer in excess of 1 sec. Relays may be subjected 260 °C peak solder reflow temperature, 1 minute, 3 passes. Butt-lead ends are coplanar within.003" (0.08mm). Application notes available for PCB mounting information.
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