Details, datasheet, quote on part number: MULTIWATT15
DatasheetDownload MULTIWATT15 datasheet


Features, Applications

item # material thickness thermal conductivity 3.9 W/cmC 3.9 W/cmC
copper high thermal conductivity Cu soft solder ( tin / lead ) epoxy resin

Charts enclosed : 1) Rth(j-c) vs. die size and dissipating area 2) Rth(j-a) vs on board heat sink area 3) Zth(j-a) vs time width and die size

= 2 Watt, mounted on board die size = 35.000 sq.mils dissipating area = 2.000 sq.mils
= 2 Watt, mounted on board die size = 175x195 sq.mils dissipating area =16.000 sq.mils


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